Intel Broadwell CPUs will Get BGA Casing

The Internet community is energetically discussing unofficial info concerning the future Intel's Broadwell processors. According to the yet unacknowledged data, Intel will branch off from currently traditional LGA casings in favor to a more advanced BGA solution. At present all CPUs designed by Intel specifically for desktop platforms feature LGA (Land Grid Array) casings which allow the users to upgrade their systems without any hassle. On LGA implementation, the chip is housed within a socket and contacts with the motherboard. As a result, the user might change one chip to the other only with similar set of contacts.



The launch of Intel Broadwell processors, which is planned for 2014, might dramatically change the situation for customers. Most probably Intel will refuse from LGA casings and accommodate all new CPUs in BGA ones, marking the change of Haswell generation to the future Broadwell generation developed under 14 nm technological process. BGA (Ball Grid Array) …

NOX Outs Coolbay VX Zero PC Chassis

NOX Xtreme Products S.L. Corporation is glad to announce the availability in the European market of a new PC chassis, entitled Coolbay VX Zero. This mid-tower model features 465x490x165 mm dimensions, sitting is a SGCC steel case. It has got a black-and-white exterior coating, a totally black interior, a metallic grid on the frontal facet, as well as an acrylic window of the side facet. All those peculiarities add to the sleek style of the chassis.



NOX Coolbay VX Zero is supposed to accommodate micro-ATX or standard ATX motherboards. Its internal spacing is estimated for the integration of three 5.25-inch optical drives and seven 3.5/2.5-inch HDD/SSDs. The rear section of the case contains seven PCI slots for expansion cards. Upon the whole, the layout promotes for the installation of 350 mm long graphics cards, 160 mm high CPU coolers.


Furthermore, the model is equipped with an inbuilt dock-station on the top facet for the connection of a single 3.5/2.5-inch hard drive. …

Presentation of a Professional Graphics Card AMD FirePro W9000

Within the bounds of AMD Fusion Developer Summit, Advanced Micro Devices has presented its new graphics card AMD FirePro W9000. The new graphic solution is based on a couple of 28-nm Tahiti chips and is actually a prototype of Radeon HD 7900 adapter. FirePro W9000 is chiefly targeted at professionals used to work with 3D technologies and video editing applications.



AMD FirePro W9000 is based on a red circuit board developed to work with PCI Express 3.0x16 bus. The cooling system is represented by a solid cooler of active type, a high-end radiator, three 90 mm. noiseless fans and copper heat tubes. The organization of additional power presupposes the availability of two dedicated eight-contact slots.


The new professional graphics card is furnished with GDDR5 memory in 6 GB volume capacity and 384 bit interface. Six DisplayPort slots are called to connect the card with displays. GPU lock frequency equals to 1 GHz which allows the card to ensure the performance in the …
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