Next year TSMC will start manufacturing the first 20nm chips

The Taiwanese company TSMC confirmed its intention to start production of chips using 20 nm technological processes in 2013. However, for now the company does not plan its production on an industrial scale and will release the first chips in a limited quantities, giving them a total of 1% of production capacity. According to the head of the company, the mass production of semiconductor chips with this technology will not begin until 2014.

Meanwhile TSMC Company is going to produce only one version of the chip, which will be able to enter into the wide range of devices, from smart phones with low-power to high-performance graphics cards. For comparison, the Taiwanese company currently has four different output chips on 28-nm technology. These are 28LP (poly / SiON) for low-power low-cost chips, 28HPL (HKMG) for use in low power applications, 28HP (HKMG) for high-performance chips and 28HPM (HKMG). The latest version combines elements of high-performance chips with high efficiency …

Meeting New Cooling System Brocken 2 from Alpenfoehn

Only a couple of weeks are left till the official release of a new cooling system Brocken 2 designed by Alpenfoehn. This is a long-awaited launch, since the fist version of the system, entitled Brocken, was honored to gladden the audience long time ago. Hereby, Brocken 2 has got a wee bit modified framework, if compared with the predecessor. Its dimensions together with a fan equal to 146x100x165 mm.

The base is shaped by means of five 6 mm copper heat pipes, tightly pressed together. Aluminum plates of the heatsink seem to be ‘cut’ in the center, unlike the one-piece construction of plates implemented in Brocken.

Active cooling power is ensured by a nine-blade fan of 140 mm standard size, known as WingBoost 2. The fan supports PWM technology that allows altering its rotational speed within the boundaries of 400-1100 RPM. Its activity stimulates the airflow index of 109 CFM, while the noise level barely achieves 19.6 dB (A). WingBoost 2 features small distance between …

Chassis Thermaltake Level 10 GT Review

Chassis with futuristic design are not novelty for the exacting consumers, but the demand for such products never slumps. In this light, practically every company that specializes on computer hardware tries to replenish its line of chassis with an item of unusual design and prominent technical characteristics. In the majority of cases, such products belong to the high-end category and cost pretty penny. Thermaltake chassis collection boasts a line of high-end products, among which is Level 10 GT model. This model is characterized by refined and stylish design, as well as, multiple facilities pertained to layout and performance.


Chassis Thermaltake Level 10 GT is developed in Full-Tower form-factor and goes with 582x282x590 dimensions. The frame and plates are made of steel, while the ornamental elements – of plastic. The casing has got external section divisions which are realized by means of the overhung details and different coloring. Upon the whole, this model …
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Registered at: 24 January 2012, 17:33
Last visit: 04 February 2014, 15:02