ASRock Introduces Affordable H110M-DS/Hyper Mainboard

ASRock enters the market with another budget-oriented micro-ATX mainboard – the H110M-DS/Hyper (the recommended price makes up $60). The greenhorn is designed on Intel H110 chipset as well as ASRock Hyper BCLK Engine. The latter realizes the overclocking of Intel Skylake CPUs (for Socket LGA1151) by means of BCLK alteration; therewith, all other key nodes operate off-the-shelf.



ASRock H100M-DS/Hyper employs 4+1-phase power subsystem. The PCB accommodates 2x DIMM slots for DDR4-2133 MHz RAM with the maximal volume of 32 GB. Storage subsystem is represented by four SATA III ports, whereas expansion facilities include one PCIe 3.0 x16 and one PCIe 2.0 x1 ports.


Audio subsystem is governed by Realtek ALC887 controller and three 3.5-mm sockets. In its turn, network facilities are backed by Realtek RTL8111GR controller. Connectivity options embrace one RJ-45 port, one DVI video port, two PS/2 ports, and four USB ports for peripherals (both v 2.0 and v 3.0).

High-Contrast Monitor BenQ BL2711U Review

There are plenty of good monitors nowadays. Nonetheless, not all of them offer a comprehensive list of much-thought facilities. BenQ decided to fill up the gap by introducing BL2711U display. The model boasts not only a remarkable image presentation but also an improved functionality. Let’s review BenQ BL2711U in more details.



Highlights


BenQ BL2711U features the following specifications:

— panel type: IPS with W-LED backlight;

— dimensions: 639x411(551)x240 mm with the stand, 27-inch diagonal;

— aspect ratio: 16:9;

— resolution: 3840x2160 pixels;

— viewing angles: 178/178 degrees h/v;

— maximal brightness: 300 cd/m2;

— contract index: static — 1000:1, dynamic – 20M:1;

— response time: 12 ms, 4 ms in GtG environment;

— amount of displayed colors: 1.07 billion;

— power consumption: maximal – 42 W, idle/standby mode – 0.5 W;

— audio: onboard speakers, 3 W each;

— interfaces: video – DisplayPort 1.2, DL …

G.Skill Showcases New RAM Memory Modules TridentX DDR3

Long-awaited Computex 2013 has brought to light the whole galaxy of innovative hardware ideas. RAM market has also replenished with new entries, partially due to G.Skill International. Its new RAM modules, codenamed TridentX DDR3, are an embodiment of utmost performance, reliability and compatibility. The new-comers have been developed to support the latest Intel’s Haswell-based CPUs i3/i5/i7, integrated into Intel Z87 Express chipset.



TridentX DDR3 are introduced by sets of two and four 240-contact DIMM modules, the total capacity of which achieves 8 GB, 16 GB and 32 GB. All of them are equipped with original in design heatspreaders. They are also known to support Intel XMP overclocking profiles and to operate at 1.65 V power voltage.


Detailed Specifications


TridentX DDR3-3000 modules will be available in 4x8 GB kits (32 GB). Their effective frequency showings make up 3000 MHz with 12-14-14-35 latencies.


TridentX DDR3-2933 modules will be available in 2x4 …
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