Evga Expands SuperNova T2 Series of High-Wattage PSUs

Evga has added to its sensational SuperNova 1600 T2 power supply unit a triplet of high-wattage models of 750 W, 850 W & 1000 W power. All of them correspond to 80Plus Titanium standard thanks to quite high efficiency level (up to 96% in 230 V networks). Moreover, the new-comers are backed by a 10-year’s limited warranty that vindicates unprecedented reliability of the asset.

Evga SuperNova T2 units come equipped with high-profile Japanese capacitors and a single +12V rail. The latter ensures that the models could stand tough loading, close to par: 748.8 W at 62.4 A, 849.6 W at 70.8 A and 999.6 W at 83.3 A respectively. The triplet is cooled down by a 140-mm fan based on dual ball bearings; on low loading the fan deactivates to provide for optimal noise level.

Similar to other advanced solutions, the greenhorns are packed with all innovative protection mechanisms, including overcurrent, overheating, overloading & short circuit tools. The list of integrated connectors …

Colorful Amazes the Public by a One-Slot iGame Graphics Card

Colorful, a Chinese developer of graphics solutions, unveils some details about its new graphics card, codenamed iGame GTX 650 Ti Buri-Slim. The most peculiar thing about this card is that it takes only one slot within a PC case, if compared with similar models from other manufacturers. The model's design resembles the one implemented in a 2011 release (iGame GTS 450 Buri-Slim).

Colorful iGame GTX 650 Ti Buri-Slim is based on a non-reference printed circuit board; the latter is a bit longer than reference GTX 650 Ti. Hardware base deserves special attention, since it's been given a note of originality, despite being a part of the entry-level adapter. Instead of traditional solid-state capacitors Colorful implemented POSCAP capacitors. Power subsystem is organized according to 3+1 template; it employs high-efficiency transistors designed by ON Semiconductor.

The integrated graphics chip and memory modules of GDDR5 standard operate at 928 MHz and 5400 MHz correspondingly. …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.

With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.

The initial stage of this program …
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Registered at: 22 October 2012, 22:55
Last visit: 30 October 2012, 00:38