SilverStone Announces Precision PS13 Chassis

SilverStone has added to its inventory a straightforward-styled mid-tower chassis. Entitled Precision PS13, the new-comer features 426x400x126 mm dimensions and weighs 3.36 kg. It is targeting micro-ATX/ATX motherboards with the maximum of 7 expansion slots. The all-black frontal panel houses a large fine-meshed grille that optimizes airflow within the case. Pricing is set at $41.25.

SilverStone Precision PS13 allows installing a pair of external 5.25-inch drives and one external 3.5-inch drive. Internal layout stipulates the installation of three more 3.5-/2.5-inch drives. Spacing is enough for quite long videocards (up to 348 mm), typical ATX PS/2 power supply units (up to 174 mm in length) and standard CPU coolers (up to 162 mm in height).

The model is available in two body variations: with (SST-PS13B-W) and without a side transparent window. Cooling is ensured by means of a single preinstalled 120-mm frontal fan. Additionally, it’s feasible to integrate five other …

Xigmatek to Release Dark Knight II CPU Cooler

Xigmatek, a multi-profile Taiwanese company, is about to launch its second version of Dark Knight CPU cooler – the SD1483. Featuring 120x50x159 mm dimensions, this tower-like device comes in two color variations: black and white (Frostbourne). The model supports processors with the utmost TDP level of 160 W, designated for AMD AM2/AM3/K8 & Intel LGA 775/1155/1156/2011 platforms.

Xigmatek Dark Knight II SD1483 consists of a small-sized heatsink with fifty-five aluminum thin fins; the latter boasts ceramic coating that is called to enhance heat dissipation area. The heatsink is pierced by three 8 mm heatpipes which support direct contact technology.

The framework also accommodates a single 140 mm fan, based on slide bearing. It is estimated for 150.000 hours of foolproof operation. The integration of PWM technology enables the variation of rotational speed from 800 RPM to 1200 RPM. The blades produce up to 90.3 CFM airflow at the maximum 18 dB noise level. According to the …

Intel Broadwell CPUs will Get BGA Casing

The Internet community is energetically discussing unofficial info concerning the future Intel's Broadwell processors. According to the yet unacknowledged data, Intel will branch off from currently traditional LGA casings in favor to a more advanced BGA solution. At present all CPUs designed by Intel specifically for desktop platforms feature LGA (Land Grid Array) casings which allow the users to upgrade their systems without any hassle. On LGA implementation, the chip is housed within a socket and contacts with the motherboard. As a result, the user might change one chip to the other only with similar set of contacts.

The launch of Intel Broadwell processors, which is planned for 2014, might dramatically change the situation for customers. Most probably Intel will refuse from LGA casings and accommodate all new CPUs in BGA ones, marking the change of Haswell generation to the future Broadwell generation developed under 14 nm technological process. BGA (Ball Grid Array) …
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Registered at: 16 September 2012, 14:27
Last visit: 16 September 2012, 14:35