Intel Broadwell CPUs will Get BGA Casing

The Internet community is energetically discussing unofficial info concerning the future Intel's Broadwell processors. According to the yet unacknowledged data, Intel will branch off from currently traditional LGA casings in favor to a more advanced BGA solution. At present all CPUs designed by Intel specifically for desktop platforms feature LGA (Land Grid Array) casings which allow the users to upgrade their systems without any hassle. On LGA implementation, the chip is housed within a socket and contacts with the motherboard. As a result, the user might change one chip to the other only with similar set of contacts.

The launch of Intel Broadwell processors, which is planned for 2014, might dramatically change the situation for customers. Most probably Intel will refuse from LGA casings and accommodate all new CPUs in BGA ones, marking the change of Haswell generation to the future Broadwell generation developed under 14 nm technological process. BGA (Ball Grid Array) …

AMD Highlights Plans for the Transition to the 28nm Process

AMD is a company known for the continual and elaborate work on the development and improvement of all product lines, as well as technological standards. Thus, the coming 2013 year is supposed to be portentous for the company in terms of the implementation of 28nm standards in their APU. AMD has recently voiced the plans for the change of the Trinity APU to a new model, codenamed Richland, and the transition to 28nm technological process.

The new APU, Richland, is presumably to be released in two versions: dual-core and quad-core. It will support a number of high-performance technologies, such as Blu-ray 3D, dual graphics, Open CL, AMD turbo core overclocking, and some others.

According to the preliminary information, Richland will employ FM2 socket (which Trinity employs) and Radeon 8000 series DirextX 11 GPU. This GPU will be furnished with 128 cores in dual-core model line, and with 384 cores in the high-end A10 APU. The same number of cores has been implemented in …

Velox V55 and Slim S55: Two New SSD Series from Silicon Power

Silicon Power, a well-known developer of flash-memory drives, as well as HHD and DRAM, has replenished its inventory with two new SSD series, codenamed Velox V55 and Slim S55. All the models included into the lineups are traditionally designed in 2.5-inch form-factor. Both series will be represented in the market by three models of 60 GB, 120 GB and 240 GB capacity. Their major advantage over rival products lies in acceleration of all operations connected with upload, speed boosting and general performance. Therefore, these SSDs are just perfect for ‘highly-demanding’ users.

Velox V55 solid-state drives are housed in resistant cases made of polished aluminum. All three models feature identical dimensions: 100x70x9 mm and weigh 79 g. The drives are based on SandForce controller and employ SATA III (6 Gb/sec) interface. The maximal sequential speed index claimed by the developer approximates 550 Mb/sec on reading operations and 470 Mb/sec on writing operations. Velox V55 …
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