Greeting Asus Maximus VI Formula Gaming Motherboard

Asus is going to put on sale its newest LGA1150 motherboard of ROG (Republic of Gamers) series, entitled Maximus VI Formula. The board features ATX form-factor and is based on Intel Z87 chipset that supports all Haswell-based Intel Core processors. The most peculiar thing about the new-comer is the availability of ROG Armor enclosure that covers the PCB on both sides. The top cover is made of ABS; it prevents the heat produced by the surrounding components (i.e. graphics adapters) from warming up the CPU and VRM systems. The rear cover is made of SECC steel that stops the PCB from bending.



Motherboard Maximus VI Formula houses four DIMM slots that support up to 32 GB dual-channel DDR3 memory modules with up to 3100 O.C MHz frequencies. 8-channel VRM system consists of NexFET transistors, Black Wing throttles, and high-efficiency solid-state capacitors. All power components are cooled down by a dedicated heatsink that is a part of a liquid-cooling system. This motherboard model …

WD Prepares Voluminous Re+ HDDs for Data Centers

Western Digital announces a new high-capacity 3.5-inch HDD for data centers. The WD Re+ will be available in versions of up to 6 TB. All of them are designed with power-saving ideas in mind; hence, their maximal power consumption index does not go above 6 W. The new-comer employs five-platter architecture and SATA 6 Gb/sec interface that guarantees the maximal efficiency level. Moreover, its MTBF index approximates 1.2 million hours on average workload index of 550 TB per year.



The WD Re+ is distinguished by the following advantages:

— the incorporation of dual actuator positioning system that improves the drive’s working efficiency;

— the implementation of RAFF technology that monitors HDD parameters in real time and compensates for the linear and angular vibration;

— the employment of StableTrac technology that reduces vibrations and stabilizes drive platters;

— the usage of TLER technology that prevents latencies or an abrupt destruction of RAID … …

Thermalright Unveils a Colossal HR-22 CPU Heatsinks

Thermalright, a top-ranked Taiwanese developer of cooling solutions, has recently unveiled its newest CPU heatsink, entitled HR-22. The new-comer features 120x150x159 mm dimensions and is peculiar by nearly ‘colossal’ cooling effect. The HR-22 is targeting all up-dated platforms with Intel LGA2011/LGA1366/LGA115x and AMD FM1/FM2/AM3/AM3+ sockets. The company promises to start the sales in the nearest future, though pricing is still unknown.



Thermalright HR-22 boasts a tower-like framework, consisting of a copper base, thirty-five aluminum plates, and eight nickel-plated heatpipes (6 mm each). The only hexagonal notch in the center is thought to simplify the heatsink installation.


All the plates contain rectangular holes that facilitate the airflow when used in passive mode. Such peculiarity is called Direct Passive Airflow System (DPAS). It not only provides for an efficient cooling and unimpeded airflow, it saves the users’ ears from noise: a powerful heatsink is …
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