Meet Gold-Certified ZM1200-EBT PSU from Zalman

Zalman is well-known for designing affordable PC components. Their budget-oriented nature implies stable but medium efficiency. Things are different with the company’s latest PSU, entitled ZM1200-EBT: it is in stark contrast to the other solutions, due to high wattage and decent performance. The model yields 1200 W power, whereas its efficiency level achieves 92%. Due to this, the unit was conferred 80Plus Gold certificate.

Gaming- & overclocking-targeting Zalman ZM1200-EBT employs a single +12V design. Its output capability is able to reach 100 A. This PSU supports Intel ATX 12V 2.3 and EPS 12V 2.92 standards. The hardware base incorporates Japanese capacitors with 105C temperature grade as well as high-quality DC-DC converters.

To continue, the greenhorn features modular cabling system. Upon the whole, the case accommodates 15 sockets for the connection of targeted wires: 8x 8-pin sockets for CPU & GPU, 2x 18-pin and 10-pin items for the motherboard, 5x 6-pin items …

HIS Offers an Overclocked R9 280 IceQ X2 OC Graphics Card

HIS is projecting to gladden all fans of highly efficient graphics cards with an indigenous design by introducing R9 280 IceQ X2 OC adapter. The new-comer differentiates itself primarily by a gold-shining coating and a factory overclocking. It is based on R9 280 Tahiti Pro GPU with dynamically heightened clock frequencies: 847 MHz/953 MHz (nominal/dynamic) against 827 MHz/933 MHz found in an etalon adapter from AMD.

HIS R9 280 IceQ X2 OC boasts 3 GB of GDDR5 video memory with 384-bit interface. It runs at the nominal 1250 MHz frequency, speeding up to an efficient index of 5.0 GHz frequency. Memory bandwidth makes up 240 Gb/sec. The integrated GPU features 1792 stream processors, 112 TMUs and 32 ROPs.

The card accommodates a couple of mini-DisplayPort video ports, as well as one HDMI and one DVI-I ports. This facilitates for the creation of multi-screen configurations. With the purpose to ensure the best image quality when working with exacting applications, the …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.

With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.

The initial stage of this program …
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Registered at: 06 June 2012, 19:36
Last visit: 06 June 2012, 19:36