Motherboard Biostar Hi-Fi Z87X 3D Review

When all the turmoil connected with the launch of new Intel Haswell processors becalmed, potential customers could finally get their own opinion about CPU facilities and decide whether an upgrade is a sensible move. A flagship motherboard from Biostar, entitled Hi-Fi Z87X 3D, proves that it worth the effort. Biostar was one of the first manufacturers in the market to pay much attention to audio subsystem. Hence, all the best audio elaborations have been aptly implemented in its flagship board.

General Specifications

Biostar Hi-Fi Z87X 3D positions itself as the motherboard for overclocking, featuring:

— chipset: Intel Z87;

— form-factor: ATX, dimensions – 305x244 mm;

— socket and supported processors: Socket 1150, Intel Haswell Pentium, Core i3/i5/i7;

— built-in graphics core: Intel HD Graphics 4600;

— memory: type – DDR3, capacity – up to 32 GB, clock frequencies – 1066 MHz – 2800 (OC) MHz;

— expansion slots: three PCI-e 2.0 x1, two …

New CPU Cooler for Small-Sized PCs from Thermalright

Thermalright boasts the release of a new CPU cooler AXP-100. The new arrival is targeting small-sized PC systems, featuring 121x105.5x58 mm dimensions. Similar to other items that take responsibility for proper CPU cooling, this model is able to provide an efficient heat extraction from processor surface and its surrounding crucial components. It is compatible with the majority of AMD and Intel sockets to guarantee its universal utilization. Hence, it supports AMD FM1, FM2, AM2, AM2+, AM3, AM3+, and Intel LGA (2011, 1366, 1156, 1155, 775) platforms.

Thermalright decided not to apply the so popular nowadays 'direct contact' technology, implying the direct contact of CPU cover with heat pipes. Instead, the cooler's framework has been given a bit different approach.

Model AXP-100 consists of a copper, nickel-plated base, six copper heat pipes, a set of aluminum ribs located parallel to the motherboard, and an atypical in its nature fan TY-100. The heatpipes spring from the …

Qualcomm to Enter Into Contract with GlobalFoundries

Qualcomm, a world-known provider of chips for mobile gadgets, has entered into a contract with GlobalFoundries company with the intention to develop chips based on 28 nm technology. Such information has been voiced by an authoritative Chinese publication Commercial Times, referring to the reliable sources. It is presupposed that the manufacturer will start the first dispatches for Qualcomm in the end of this year. The previously voiced data claimed that Qualcomm had arranged orders of 28 nm chips from UMC with the similar dispatch dates.

The estimated reason for the cooperation with GlobalFoundries is the insufficient delivery of 28 nm chips by TSMC. Moreover, Nvidia is supposedly targeting at the cooperation with one more manufacturer except for the TSMC as well. It should be mentioned that the preliminary memorandum between Qualcomm and GlobalFoundries was concluded in 2010; according to this memorandum, the designer got the access towards 45 nm LP and 28 nm LP technological …
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Registered at: 07 August 2011, 22:15
Last visit: 09 August 2011, 01:42