Cooler Master to Continue Its Series of Heatsinks with Vapor Chambers

Cooler Master has lately introduced its new lineup of coolers with the implementation of vapor chambers technology (TPC 812 series). However, the company's plans are not limited to this series only, and the upcoming release of V4 GT series is the most convincing proof of it. The new series will be based on horizontal vapor chamber technology and intended at the colling down of high-end graphics cards.

In accordance with the manufacturer's undertakings and plans, the implementation of this technology will provide for the octuple improvement of heat dispersion as compared with the solid copper-contact sink. This approach towards the processor's colling down enables the involvement of more heat pipes. Nevertheless, V4 GT model will be equipped with only four heat pipes.

Vapor chamber technology stipulates efficient removal of heat from the processor and other integral components. At the same time, it averts the creation of hot spots and promotes for the even distribution of …

Mini-PC Sapphire Edge HD3 Review

Mini-PCs are gaining popularity among people who do not want to relinquish their demands towards the performance and aesthetic appearance. Full-Tower casings will suits probably gamers and enthusiasts, laptops – to people always on move, and mini-PCs — to individuals who appreciate efficiency and ergonomics. Sapphire gladdened its customers with Edge HD2 model last year, and this season the company offers an advanced solution in the form of mini-PC Edge HD3. Indeed, this model can substitute the full-tower PC and provide for better usability.


First of all, it should be mentioned that Sapphire Edge HD3 design befits to its predecessor, HD2. The new model has got rubbered plastic enclosure, smooth shape and black color. The basic attraction for potential clientele is the mini-PC dimensions: the product does not exceed the standard paper format and will be practically invisible on the desk. Still, there is a distinction between the two models. Edge HD3 is notable …

The First Glimpse on Motherboard Foxconn B75M

Foxconn has officially announced the release of a new motherboard B75M developed in microATX form-factor. The new product will be distinguished by an attractive price and available up-to-date kit of interfaces useful for home-based and corporate PCs. B75M will be compatible with Intel Ivy Bridge processors of the third generation (Core i3, i5, and i7). This motherboard employs only high-end components which prevent the system from malfunctions or interruptions: the integration of Japanese solid-state capacitors with the minimal error-free running time which achieves sixty thousand hours. Such approach is more vital for the systems that get used to work in 24/7 mode.

The integrated PCI-E 3.0 bus allows the installation of the most updated graphics adapter. SATA III port empowers the usage of speedy SSDs and HDD potential, while three USB 3.0 ports are destined to ensure the linkage with the external devices at maximal speed index. Motherboard Foxconn B75M is also furnished with …
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Registered at: 14 August 2011, 18:06
Last visit: 14 August 2011, 18:06