Overview of the Chieftec FI-03B Case

Ever since with the light touch of the VIA Technologies the Mini-ITX motherboard standard has entered the consumer market, ample opportunities have opened up for fans of compact computer systems. However, the main problems of the still new form factor were quickly identified then. The most painful among them were issues of components compatibility (which were all produced for a more common ATX format), the problem of their cooling and, of course, the complete absence of sane small cases capable of taking such systems in.


In solving problems with the chassis, the industry initially chose two parallel paths. On the one hand, tiny boxes supplied with an external power supply were put into production. The maximum that they were able to accept was the processors from VIA and Intel with TDP not more than 20 watts. On the other hand, cases where it would be possible to assemble a good game system based on the Mini-ITX motherboard were created. But in size, they often reached the …

Meet the First RAID Controller with Sixteen SATA 6 Gb/sec Ports

Adaptec by PMC introduces the first in the market RAID controller series with the outstanding amount of SAS/SATA 6 Gb/sec ports. Adaptec Series 7 combines low-profile expansion cards developed particularly for PCI Express 3.0 bus. The integrated properties are called to enhance the bandwidth of the bus due to the availability of sixteen SAS/SATA 6 Gb/sec ports.



According to the claimed specifications, these RAID controllers are capable to demonstrate up to 450000 IOPS performance (on random writing (4 KB) conditions) when the number of connected SSDs equals to 16. Such performance showings are currently insuperable by a number of contemporary RAID controllers.


Adaptec Series 7 includes eight models which are differentiated by an amount of external and internal ports. All the models are low-profile expansion cards which are equipped with up to 24 ports. Such technological innovation became possible thanks to the implementation of compact HD mini-SAS sockets and …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …
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