New RAM Modules Ballistix Sport SODIMM from Lexar Media



Lexar Media, a well-known American designer of diverse digital media products, starts selling its new RAM series from Ballistix line. Entitled Sport SODIMM, the series is introduced by four SODIMM-DDR3 modules, intended for the incorporation into gaming laptops: BLS4G3N169ES4, BLS8G3N169ES4, BLS4G3N18AES4, and BLS8G3N18AES4. The quadruple is distinguished by an original design with the implementation of unique heatspreaders. All of them are optimized for Intel Core i5/i7 mobile processors of the fourth generation (Intel Haswell platform) and support all up-dated XMP profiles.


The most beneficial feature applied to Ballistix Sport SODIMM modules is their power-saving nature. They are able to operate at 10% lower power voltage than analogous products; hence, they reduce the laptop’s power consumption index and increase the time of its offline work.


To continue, the first two models, BLS4G3N169ES4 and BLS8G3N169ES4, come in 4 GB and 8 GB capacities correspondingly. They …

Welcome in a New Mid-Tower GT-A Chassis from Aerocool

Aerocool Advanced Technologies, an award-winning hardware manufacturer from Taiwan, is glad to announce the replenishment to the GT series, launching Aerocool GT-A — a budgetary mid-tower chassis. The model features 475x185x485 mm dimensions and is housed in a zinc-coated steel SECC case. Moreover, potential customers might revel in both, Black Edition and White Edition case versions. Retail price set by the manufacturer makes up 66 EUR.



Aerocool GT-A is targeting saving gamers with particular demands towards the chassis design. Hence, it boasts a non-trivial design with perforated frontal panel, a large side-panel acrylic window, as well as a dedicated dock-station for 2.5/3.5-inch drives. The layout is characterized by the support for ATX, micro-ATX and mini-ITX motherboards, the availability of three 5.25-inch drive bays (external), a triplet of 3.5 inch internal drive bays and identical number of 2.5-inch drive bays.


Expansion facilities are introduced by seven slots …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …
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