Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.

With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.

The initial stage of this program …

Greeting an Affordable Z170A-X1/3.1 Mainboard from ASRock

ASRock is known for developing high-quality hardware components for a relatively affordable price. Thence, its latest Z170A-X1/3.1 ATX mainboard is not an exception, since its price tag does not go beyond $100. In order to cheapen the prime cost, the manufacturer backed away SATA Express & M.2 connectors, limiting the PCB by six SATA III 6 Gb/sec ports.

To add, instead of a modern 8-channel audio controller it incorporated a well-known Realtek ALC892 item. The other boons of modernity remained unchanged. Thus, ASRock took Intel Z170 top chipset as the basis for the motherboard. The chipset is targeting the latest Intel Skylake CPUs for Socket LGA1151. The PCB accommodates 4 DIMM slots for dual-channel DDR4-3466 MHz RAM (up to 64 GB max. capacity).

Graphics facilities are ensured thanks to a pair of PCI Express 3.0 x16 slots, although there are three more PCI Express 3.0 x1 slots for the connection of other items. Network options are entrusted to gigabit Intel I219V LAN …

Welcome In New LPDDR4 Memory Chips from Samsung

Samsung settles down to a large-scale production of LPDDR4 mobile memory chips. Elaborated according to 20 nm technological norms, the new-comers boast the integration of an advanced technology that ensures 8 Gb crystal density and twice the performance compared with LPDDR3 chips. Currently, the company produces models of 2 GB and 3 GB capacity, however in early 2015 it will set to the development of 4 GB solutions.

New LPDDR4 memory modules are targeting various mobile devices with thirst for lightning-fast data transfer speed. The latter index might accelerate up to 3200 Mb/sec; this will allow employing chips for the implementation of resource-intensive tasks, such as recording and playback of high-resolution video or serial filming.

Samsung developers claim that 2 GB LPDDR4 DRAM is 40% more power-efficient than counterparts with 4 Gb crystal density. This became possible due to the adopting of low-voltage swing-terminated logic for I/O signaling. As a result, the …
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Registered at: 10 December 2011, 15:40
Last visit: 14 December 2011, 09:03