Spire Launches Ridge 6601 and Ridge 6602 PC Chassis

Spire has officially launched a new line of budgetary PC chassis, codenamed Spire Ridge. At the moment, there are only two models within the series – the Ridge 6601 and the Ridge 6602. Both are characterized by the support for ATX motherboards and have many other identical specifications: i.e. mid-tower form-factor, 192x415x418 mm dimensions. Still, there are some differentiations as well.

The first distinction between the two models lies in the frontal panel design. Therefore, Ridge 6601 features a laconic panel made of plastic without additional ventilation. In its turn, Ridge 6602 features a half-perforated metallic frontal panel that allows for a more intense cooling of internal components.

The couple boasts identical expansion facilities with two 5.25-inch buckets for optical drives, four 3.5-inch buckets for HDD/SSD, and seven expansion slots. Connectivity options are introduced by a set of frontal interfaces, including two audio slots, one USB 2.0, and one USB …

Preliminary specifications and release date of GeForce GTX 6500

On August 16 it is planned to release one of the first mainstream cards Nvidia family Kepler — GeForce GTX 660 Ti. Different sources are still disagree considering its characteristics. It is known that it will be based on the graphic chip GK104 and have a more modest power system than the GTX 670. Crippled in its capability GPU GK104 will form the basis for GeForce GTX 660 and, probably, GTX 650 Ti. Boards of mainstream class and below will use the processor GK107.

Actually, GK107 is already present in the market as part of the line of video cards GeForce GT 640, but it limits the potential by slower memory DDR3. Release of modifications GT 640 with GDDR5 chips on board, according to foreign analytics is just a matter of time.

It is believed that the GeForce GT 640 GDDR5 will receive commercial name GeForce GTX 650. This assumption is not without logic, because it will be easier for Nvidia to sell large quantities of video cards (notice how long the Santa Clara did not …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.

With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.

The initial stage of this program …
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Registered at: 03 July 2012, 00:24
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