Meet New External HDD Armor A30 from Silicon Power

Silicon Power, a renowned manufacturer of flash-memory devices, is going to release a new external HDD, entitled Armor A30. The drive features 134x87.5x18.6 mm dimensions and is estimated to operate at +5-+55 C temperatures. The most outstanding peculiarity pertained to Armor A30 is its compliance with MIL-STD 810G Method 516.6 Procedure IV standard. This implies the drive is housed in a super-solid ‘silica gel’ case that is able to survive the fall from a height of 122 cm, strong vibrations, temperature alterations, and to resist dust and water.



Silicon Power armor A30 will be available in two capacities (500 GB and 1 TB) and two color variations (white and black). All the models employ high-speed USB 3.0 interface and offer some notable performance. Hence, these HDDs feature maximal 5 Gb/sec data transfer speed (USB 3.0 interface) and up to 480 MB/sec (USB 2.0 interface). It should be stressed that the drive receives power via USB interface as well and is compatible with …

Greeting New ProLite X2783HSU Full-HD Monitor from Iiyama

Iiyama Corp., a leading Japanese designer of high-end PC monitors and TV-sets, has recently released a new representative of ProLite series – the X2783HSU Full-HD monitor (1920x1080 resolution). The new-comer features 622.5x400.5x230 mm dimensions and 27-inch display with an anti-glare coating. Its case boasts a stylish, black glossy finish that adds to the model’s elegant design.



The Iiyama ProLite X2783HSU is based on AMVA+ array that comes along with a rear LED backlit. The array demonstrates the following specifications: aspect ratio – 16:9, response timeframe – 4 ms (GtG), contrast – 3000:1/5M:1 static/dynamic, viewing angles – 89/89 degrees up/down and 178/178 degrees H/V, amount of displayed colors – 16.7 m, maximal brightness – 300 cd/m2, synchronization – separate.


The monitor is equipped with a pair of speakers of 4 W power, an analog D-Sub connector, digital HDMI and DVI-D (with HDCP support) connectors, I/O audio connectors, Kensington lock, …

Cooler Master to Continue Its Series of Heatsinks with Vapor Chambers

Cooler Master has lately introduced its new lineup of coolers with the implementation of vapor chambers technology (TPC 812 series). However, the company's plans are not limited to this series only, and the upcoming release of V4 GT series is the most convincing proof of it. The new series will be based on horizontal vapor chamber technology and intended at the colling down of high-end graphics cards.



In accordance with the manufacturer's undertakings and plans, the implementation of this technology will provide for the octuple improvement of heat dispersion as compared with the solid copper-contact sink. This approach towards the processor's colling down enables the involvement of more heat pipes. Nevertheless, V4 GT model will be equipped with only four heat pipes.


Vapor chamber technology stipulates efficient removal of heat from the processor and other integral components. At the same time, it averts the creation of hot spots and promotes for the even distribution of …
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Registered at: 09 August 2012, 12:01
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