Telum and Ferrum: the Continuators of Aerocool Templarius Genus

Aerocool proudly introduces two new PC cases that have been entitled as Templarius Telum and Templarius Ferrum. As seen from the titles, the novices continue Aerocool's Templarius chassis line and are called to become their worthy representatives. Both models are appropriate for the mounting of gaming computers and other powerful systems. Moreover, they are already on sale, so gamers and other enthusiasts can taste all their benefits in real time.



PC cases Telum and Ferrum are developed in full-tower ATX form-factor. Their dimensions, 420x185x435 mm and 460x200x455 mm correspondingly, promote for the installation of truly voluminous and mighty components: CPU coolers up to 158 mm in height and graphics adapters up to 400 mm in length. Internal framework allows the user to create a really efficient cooling environment, providing room for up to ten fans. Besides, the chassis are equipped with dedicated holes for the water-cooling organization; all tubes and a heatsink can be …

Deepcool Comes Out with Tesseract SW-RD Chassis

Deepcool Industries Co. Ltd. has expanded its production line with a new mid-tower case, entitled Tesseract SW-RD. The chassis features 472x210x454 mm dimensions and weighs 4.97 kg. It is made of galvanized SECC steel plates, boasting a large side acrylic window & black-and-red frontal frame. The top panel houses I/O panel with a pair of USB ports (both 2.0 and 3.0 versions are available) as well as a couple of audio ports.



Deepcool Tesseract SW-RD is compatible with mini-ITX, micro-ATX and ATX motherboards. The layout offers two external 5.25-inch slots, four internal 3.5-inch slots, three internal 2.5-inch slots, and seven slots for PCI expansion cards. All the racks are equipped with slides which facilitate installation of drives without any screws.


To continue, the case is ready to welcome 310-mm-long VGA cards, 168-mm-high CPU coolers as well as standard power supply units. The motherboard tray accommodates a dedicated notch that allows installing the CPU cooler …

Welcome In New LPDDR4 Memory Chips from Samsung

Samsung settles down to a large-scale production of LPDDR4 mobile memory chips. Elaborated according to 20 nm technological norms, the new-comers boast the integration of an advanced technology that ensures 8 Gb crystal density and twice the performance compared with LPDDR3 chips. Currently, the company produces models of 2 GB and 3 GB capacity, however in early 2015 it will set to the development of 4 GB solutions.



New LPDDR4 memory modules are targeting various mobile devices with thirst for lightning-fast data transfer speed. The latter index might accelerate up to 3200 Mb/sec; this will allow employing chips for the implementation of resource-intensive tasks, such as recording and playback of high-resolution video or serial filming.


Samsung developers claim that 2 GB LPDDR4 DRAM is 40% more power-efficient than counterparts with 4 Gb crystal density. This became possible due to the adopting of low-voltage swing-terminated logic for I/O signaling. As a result, the …
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Registered at: 21 October 2011, 10:22
Last visit: 26 October 2011, 13:00