Meet New Gigabyte G1 Gaming Motherboards on Intel 9th Series Chipsets

Gigabyte has officially introduced a new line of motherboards based on the innovative Intel Z97/H97 chipsets. The G1 Gaming series features a traditional black-and-red PCB design and is supposed to cooperate with Intel Core CPUs (4th and 5th generation). Far and by, the series counts thirteen models of varied formats (ATX, micro-ATX, mini-ITX), with varied functional. Such a variety will help gamers of different levels to select an optimal model so far as the price and facilities are concerned.



Indeed, each motherboard boasts a singular set of facilities, although there are some common to all 13 models specifications:

— support for Multi-GPU technologies, i.e. Nvidia SLI and AMD CrossFireX;

— availability of SATA Express connector with 10 Gb/sec bandwidth;

— integration of high-speed M.2 port with up to 10 Gb/sec bandwidth;

— availability of two external ports for a stable output voltage: Gigabyte USB DAC-UP;

— implementation of high-efficiency network …

Seagate Showcases New Enterprise-Class HDD Models

Seagate, one of the global leaders in HDD/SSD market, has elaborated and showcased two new enterprise-class HDD models. Codenamed Seagate Enterprise Performance 10K HDD v7 and Seagate Terascale, both entries are intended to be employed in data-centers and cloud storage systems. According to the designers, the drives are an optimal combination of capacity, efficiency and price. Hence, such specifications can’t but draw huge attention.



The first model, Seagate Enterprise Performance 10K HDD v7, is developed in 2.5-inch form-factor and utilizes SAS 6 internal interface. It comes in 1200 GB capacity with 64 MB cache-memory on board. The maximal spindle rotational speed achieves 10 thousand RPM, while the average index of power consumption makes up 8.02 W.


This HDD is primarily notable by low data access lags, as well as by high efficiency in the majority of working modes. Besides, it supports FIPS Self-Encrypting Drive and Protection Information technologies that are called …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …
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