Scythe Showcases Asymmetric Byakko CPU Cooler

Scythe, a well-known Japanese manufacturer of cooling solutions, is about to release an uncommon CPU cooler. Entitled Byakko, the Tower model features an asymmetric design: an aluminum heatsink is superseded backwards against the nickel-plated base; such framework ensures an ideal compatibility of the cooler with high RAM modules. Moreover, the item is only 130-mm high, so it can fit any PC case.

Scythe Byakko is reconcilable with the majority of modern platforms, including Intel Socket LGA 1366/115x/775 & AMD Socket FM1/FM2/FM2+/aM2/AM2+/AM3/AM3+. The cooler accommodates three nickel-plated 6-mm heat pipes, replenished by a single 92-mm fan. The Scythe Slip Stream 92 PWM is based on a sleeve bearing. Thanks to the PWM support, the fan is able to rotate within 300-2300 RPM range. Therewith, the maximal noise level does not surpass the margin of 28.26 dBA (the minimal index is 7.2 dBA).

The model is able to produce 6.70-46.55 CFM airflow, depending on the rotational speed. …

D-Link Showcases AC1900 DWA-192 USB Adapter

D-Link announces the availability of a new wireless USB adapter, entitled AC1900 DWA-192. It is called to facilitate the connection of desktop/mobile PCs (as well as multimedia & gaming devices) to wireless 802.11ac networks, providing up to 1300 Mb/sec within the 5 GHz range or 600 Mb/sec within the 2.4 GHz range.

D-Link AC1900 DWA-192 features USB 3.0 interface, connecting directly to the PC/laptop without additional power source. High-speed interface ensures super-fast data transfer speed (5 Gb/sec) in order to comply with the latest wireless requirements. This adapter proves to be rather efficient when combined with AC1900 DIR-880L or AC3200 DIR-890L wireless routers.

The model employs MIMO 3x4 chip with an integrated Smart-antenna and an amplifier. It supports AC SmartBeam technology that is intended to form a directional signal, void of any interference. Moreover, it provides for a smooth broadcasting of HD video, high-quality gaming and video-chatting, fast file …

Welcome In New LPDDR4 Memory Chips from Samsung

Samsung settles down to a large-scale production of LPDDR4 mobile memory chips. Elaborated according to 20 nm technological norms, the new-comers boast the integration of an advanced technology that ensures 8 Gb crystal density and twice the performance compared with LPDDR3 chips. Currently, the company produces models of 2 GB and 3 GB capacity, however in early 2015 it will set to the development of 4 GB solutions.

New LPDDR4 memory modules are targeting various mobile devices with thirst for lightning-fast data transfer speed. The latter index might accelerate up to 3200 Mb/sec; this will allow employing chips for the implementation of resource-intensive tasks, such as recording and playback of high-resolution video or serial filming.

Samsung developers claim that 2 GB LPDDR4 DRAM is 40% more power-efficient than counterparts with 4 Gb crystal density. This became possible due to the adopting of low-voltage swing-terminated logic for I/O signaling. As a result, the …
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Registered at: 08 October 2012, 12:44
Last visit: 09 October 2012, 04:00