Official Presentation of CPU Cooler Thermaltake BigTyp Revo

Thermaltake, a world-known producer of thermal solutions, chassis and PSU, has officially presented its new CPU cooler modification, codenamed BigTyp Revo. This model has already been introduced at Computex 2012 where it got a lot of encouraging reviews and good prospects for the sale campaign. BigTyp Revo is considered to be an efficient solution for the cooling down of the around-socket spacing due to the horizontal radiator localization. Thermaltake representatives underline that their new product is compatible with Intel (LGA775/1155/1156/1366/2011) and AMD (Socket AM2(+)/AM3(+)/FM1) platforms.

BigTyp Revo framework consists of a compact radiator, low-noise fan, five heat pipes and a set of aluminum plates. The new model has got an aluminum base and is furnished with five copper heat pipes (6 mm each). Each of the pipes directly 'gets in touch' with the CPU surface, providing an outstanding heat removal power. The top of the radiator accommodates 120 mm fan which can be …

The Launch of New Generation Core i3 is Planned for Early September

The recent launch of Intel's Ivy Bridge processors based on a new microarchitecture has touched upon Core i5 and Core i7 series. Currently, the company is working vigorously on the advancement of its Core i3 series, as well as, Pentium G2100T and G2120 models. The latter will be designed on similar to its 'brethren' architecture. In accordance with the voiced information, the new processors will be released in early September.

The nominal lineup of Core i3 processors will include five models; processors with T index (i3-3220T and i3-3240T) will be characterized by low power consumption (up to 35W) and average frequencies which will fluctuate in the ranges of 2.8-3 GHz. Senior models (i3-3220 and i3-3225) will operate at 3.3 GHz and have TDP index of 55W, while the superior model Core i3-3240 will achieve the frequency index of 3.4 GHz. These models are distinguished by the availability of more efficient integrated HD 4000 graphics type.

Upon the whole, the third …

Welcome In New LPDDR4 Memory Chips from Samsung

Samsung settles down to a large-scale production of LPDDR4 mobile memory chips. Elaborated according to 20 nm technological norms, the new-comers boast the integration of an advanced technology that ensures 8 Gb crystal density and twice the performance compared with LPDDR3 chips. Currently, the company produces models of 2 GB and 3 GB capacity, however in early 2015 it will set to the development of 4 GB solutions.

New LPDDR4 memory modules are targeting various mobile devices with thirst for lightning-fast data transfer speed. The latter index might accelerate up to 3200 Mb/sec; this will allow employing chips for the implementation of resource-intensive tasks, such as recording and playback of high-resolution video or serial filming.

Samsung developers claim that 2 GB LPDDR4 DRAM is 40% more power-efficient than counterparts with 4 Gb crystal density. This became possible due to the adopting of low-voltage swing-terminated logic for I/O signaling. As a result, the …
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Registered at: 26 September 2012, 15:52
Last visit: 26 September 2012, 16:06