MSI Introduces a Pair of Cubi 2 Mini-PCs

MSI has enriched its inventory with a pair of mini-PCs. The Cubi 2 Plus and the Cubi 2 Plus vPro feature 155.3x147.9x58.6 mm dimensions. Both models come equipped with a 90-watt power adapter and run on Windows 10 Home OS. The first new-comer is based on Intel H110 chipset, while the second one – on Intel Q170 version. The pair supports the installation of either Intel Core i3-6100T CPU (3.2 GHz frequency), Intel Core i5-6500T (2.5-3.1 GHz frequency) or Intel Core i7-6700T (2.8-3.6 GHz frequency).

MSI Cubi 2 Plus mini-PCs employ Intel HD Graphics 530 GPU, up to 32 GB of DDR4-2133 MHz RAM, allowing to install a single M.2 SATA solid-state drive (up to 256 GB capacity) and a single 2.5-inch SATA HDD/SSD (up to 1 TB capacity). Network facilities are introduced by Bluetooth 4.0 adapter, Gigabit Ethernet port, 802.11b/g/n or 802.11ac Wi-Fi module.

To continue, MSI Cubi 2 Plus boasts rich connectivity; it is furnished with: two USB 3.1 (Type-A & Type-C) ports, one USB 2.0 …

Qualcomm to Enter Into Contract with GlobalFoundries

Qualcomm, a world-known provider of chips for mobile gadgets, has entered into a contract with GlobalFoundries company with the intention to develop chips based on 28 nm technology. Such information has been voiced by an authoritative Chinese publication Commercial Times, referring to the reliable sources. It is presupposed that the manufacturer will start the first dispatches for Qualcomm in the end of this year. The previously voiced data claimed that Qualcomm had arranged orders of 28 nm chips from UMC with the similar dispatch dates.

The estimated reason for the cooperation with GlobalFoundries is the insufficient delivery of 28 nm chips by TSMC. Moreover, Nvidia is supposedly targeting at the cooperation with one more manufacturer except for the TSMC as well. It should be mentioned that the preliminary memorandum between Qualcomm and GlobalFoundries was concluded in 2010; according to this memorandum, the designer got the access towards 45 nm LP and 28 nm LP technological …

Thermaltake Introduces Mid-Tower Soundproof Chassis New Soprano

Thermaltake proudly introduces a new series of PC chassis, codenamed New Soprano. The series is represented by two models: a model with totally white external casing New Soprano Snow Edition and a model with totally black casing. Both chassis are developed in Mid-Tower form factor and are a perfect choice for high-end systems with minimal noise effect. They are predestined for the employment with the motherboards of ATX and micro-ATX dimensional type.

The major privilege of the series is seen in the implementation of soundproof casing that saves the user from bothersome noise. The casing employs steel as the major material (SECC) and features plastic clipboard. The walls are covered by a soundproof foam from the inside and provide for the utmost silence facilities.

The top panel accommodates an integrated dock-station used for the connection of a single 2.5/3.5-inch winchester. The upper part of the facade is equipped with two USB 2.0 and two USB 3.0 ports, as well as a …
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Registered at: 06 August 2012, 04:20
Last visit: 06 August 2012, 13:19