Lian Li Launches New Full-Tower Chassis PC-A79

Lian Li has recently launched a new PC chassis, entitled PC-A79. The chassis is designed in full-tower format, featuring 230x618x596 mm dimensions. As a result, it supports a full range of motherboard standards, including micro-ATX, ATX, E-ATX, XL-ATX, and HPTX. According to Lian Li, the product is distinguished primarily by a well-considered cooling system and the availability of a removable motherboard tray. All potential customers are free to choose between a black variation (PC-A79B) and a silver variation (PC-A79A).



The case of PC-A79 chassis is made of brushed aluminum. Its spaciousness can’t but be distinct from similar products offered by competitors. Hence, it is able to accommodate nine drives of 3.5-inch standard and eight drives of 2.5-inch standard; all of them might be adjusted without any tools. The availability of eleven expansion slots provides for the installation of several lengthy graphics cards (up to 350 mm). The maximal height of supported CPU coolers …

CPU Cooler Deepcool Ice Blade Pro v2.0 Review

Deepcool can be boldly attributed to the manufacturers that are constantly improving their mastery is the elaboration of hardware components. The company’s second revision of CPU cooler Ice Blade Pro is a bright confirmation of this statement. Codenamed Ice Blade Pro v2.0, this product is supposed to exceed its predecessor in performance, noise level and consumer appeal. But let’s start its reviewing from technical peculiarities.



Technical Peculiarities


Deepcool Ice Blade Pro v2.0 features the following specifications:

— dimensions: 161x125x70 mm (+fan(s) 120 mm), ultimate weight – 981 g;

— compatibility: Intel Socket LGA 2011/1366/1156/1155/775, AMD Socket 939/FM1/FM2/AM2/AM2+/AM3/AM3+;

— heatsink: tower framework consists of 49 aluminum plates, 4 heatpipes and a base supporting Core Touch technology;

— fan: dimensions — 120x120x25 mm, type of bearing – fluid-film bearing, nominal/startup fan voltage – 12/7 V, maximal power consumption – …

Intel Broadwell CPUs will Get BGA Casing

The Internet community is energetically discussing unofficial info concerning the future Intel's Broadwell processors. According to the yet unacknowledged data, Intel will branch off from currently traditional LGA casings in favor to a more advanced BGA solution. At present all CPUs designed by Intel specifically for desktop platforms feature LGA (Land Grid Array) casings which allow the users to upgrade their systems without any hassle. On LGA implementation, the chip is housed within a socket and contacts with the motherboard. As a result, the user might change one chip to the other only with similar set of contacts.



The launch of Intel Broadwell processors, which is planned for 2014, might dramatically change the situation for customers. Most probably Intel will refuse from LGA casings and accommodate all new CPUs in BGA ones, marking the change of Haswell generation to the future Broadwell generation developed under 14 nm technological process. BGA (Ball Grid Array) …
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