The Introduction of Transparent Chassis from Scythe

Scythe has recently amazed the community by the introduction of absolutely transparent chassis. ACB-Type3 model preserves the cutout of the standard Mid-Tower chassis solutions, but is made of transparent acrylic plates. One more peculiarity of this model is the parallel to the base localization of motherboard. Besides, ACB-Type3 is compatible with motherboards of various form-factor, including mini-ITX, micro-ATX, and ATX.

The motherboard is accommodated on a special tray. Right under this tray the customers are able to find a set of bays designated for the installation of PSU, three 3.5-inch drives, a couple of 2.5-inch drives, and three 5.25-inch drives. The chassis is compatible with CPU coolers of up to 190 mm in height.

At the same time, this model goes without any fans or side panels; this attributes the model to Open-Air segment. The product can content itself with practically noiseless passive system.

Scythe ACB-Type3 is equipped with sufficient number of …

FSP Intros ‘Noiseless’ PSU Model Aurum Xilenser 500

FSP, a renowned developer and supplier of power supply units, introduces a new product that is widely recognized as ‘noiseless’ PSU. Codenamed FSP Aurum Xilenser 500 (AU-500FLD), it employs a passive cooling system instead of an air cooler, thus its dump operation is easily explainable. The unit also characterizes by a startling efficiency which provided for the acceptance of 80+ Gold certificate.

Aurum Xilenser 500 takes similar to Aurum Pro/CM models design with a totally black casing and a comb-like top grid enclosed in a golden stripe. The model is able to operate at the nominal 500W power and support the latest ATX12V/EPS12V standards. It should be noted that this unit utilizes a standard framework with all power connectors soldered on the printed circuit board. A set of connectors involves five SATA connectors, a single 4-contact FDD, four 4-contact Molex, and a pair of 6+2-contact PCI Express connectors. Naturally, it contains two main 24-contact and 4+4-contact …

Xeon Phi: Revolutionary Offer from Intel Developers

Intel Corporation has made a resolute step towards the improvement of performance demonstrated by ‘supercomputers’. Its new Intel Xeon Phi is called to create a real revolution in the IT world, offering unmatched performance showings on activities with the high parallelism degree. This is supposed to bring supercomputers to the new level by means of enlarging the performance levels from TFLOP to EXAFLOP. Upon the whole, Xeon Phi is the name which will be used for further line of products based on Intel MIC architecture.

Xeon Phi coprocessors are sure to enable the transmission of the reduced data via PCI slots and will primarily be applied to dedicated coprocessors. The sales start is designated to the end of the current year, and the first products presented in the market will be items which belong to Knights Corner series. According to the Intel developers’ words, Xeon Phi will firstly replenish the series of central processors Intel Xeon E5-2600/4600; further on, the …
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Registered at: 21 November 2012, 21:36
Last visit: 21 November 2012, 21:36