Scythe Mugen 5 Is a Powerful CPU Cooler Up to 160 mm High

A new sample – Scythe Mugen 5 (SCMG-5000) – has come into line with the famous Scythe Mugen series. Its asymmetric Tower construction enhances compatibility with long RAM modules. The dimensions of the unit are 154.5 х 130 х 110 mm, and the weight equals to 890 g, which widens the range of chassis able to hold it.



Scythe Mugen 5 possesses a nickel-plated copper base frame, six nickel-plated copper heat pipes, an aluminum heatsink and a 120 mm Scythe Kaze Flex 120 PWM axial flow fan. It is constructed with refined hydrodynamic bearings (Sealed Precision FDB) with the specified life span of 120,000 hours. The rotary speed of 300–1,200 rpm is able to create an airflow in the volume of 16.6–51.17 CFM (28.2–86.93 m3/hr). The static pressure is estimated to be 0.076–1.05 mm H2O, and the noise level lies in the range of 4–24.9 dBA. One can optionally install another analogous fan on the other side.


The brand Hyper Precision Mounting System II makes it possible to …

SSDs Corsair Neutron and Corsair Neutron GTX Review

Current conjuncture in the market of drives proves that SSDs do not require special advertising. Their demand index rises every single day, along with the increasing supply. Corsair, a well-known manufacturer of various PC hardware solutions, has successfully 'assimilated' advanced LAMD LM87800 controllers, and developed two SSD items at once based on this controller. Codenamed Corsair Neutron and Corsair Neutron GTX, these drives are intended at different customer audiences. Both models feature similar internal layout, but differ in the integrated interfaces and memory types.



Specifications


Model Corsair Neutron is considered to be cheaper than GTX version, so its specifications are more modest. It employs MLC flash-memory type with ONFI interface developed under 25 nm technological process. Its companion, Corsair Neutron GTX, belongs to the high-end SSD echelon and employs MLC flash-memory type with Toggle Mode interface designed under 24 nm technological process. Both …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …
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