NVIDIA to Increase Graphic Performance in Mobile Devices

All new devices that appear in IT market are treated with great attention from the part of contemporary customers. All functional characteristics, design and other possibilities are considered in details. Graphics isn’t exclusion and is always under intent look of users and IT experts. Computer and game console graphics went over the line of unnatural imaging long time ago and became a genuine embodiment of real life. Nowadays it is not a problem for the gamer to totally plunge into the world of fantasy or battle-front since the graphics presents data with real authenticity.

NVIDIA, the world-known developer of discrete graphic chipsets for personal computers and mobile devices, strides confidently in the direction of graphics performance improvement. Company specialists are currently working at the perfection of graphics performance on mobile devices and game consoles. IT analysts dare to assume that functional characteristics of graphic core sets on mobile devices will catch …

Company LEPA produces new power supplies B-series

LEPA introduced three new power supplies — B650-SA, B700-MAS and the B800-MAS, which will replace older models B750-MA, and B850-MA. Newcomers have been certified with 80 Plus Bronze (efficiency of 88% of the networks 230V), and met the standards of ATX12V v2.3 and EPS12V 2.92, and positioned as solutions for gamers and owners of GPU configurations SLI and CrossFire, workstations and small servers.

New items are equipped with inverter DC-DC (to improve stability), have the topology of Double Forward Circuit, as well as high-quality electrical components: solid capacitors and heat resistant (105 ° C) capacitors made in Japan.

Active cooling LEPA B700-MAS/B800-MAS is provided by 140-mm fan on double bearings. The model B650-SA has a fan size of 120 mm. The intensity depends on the rates of temperature sensor. Power Cables PCI-E, SATA and Molex flat are detachable. The main ATX 24-pin, as well as “CPU” EPS12V 8-pin are collected in a nylon sheath. LEPA B650-SA has …

Thermalright Launches New Low-Profile CPU Cooler AXP-200

Thermalright, a Taiwanese developer of advanced cooling solutions, enters into the market with a new low-profile CPU cooler – the successor of the last year’s model AXP-100. Codenamed AXP-200, the product features 150x140x60 mm dimensions and is intended to be incorporated into HTPC systems, as well as in compact PC chassis with the support of mini-ITX motherboards. This cooler is compatible with the majority of up-dated platforms, including Intel LGA 1150/1155/2011/1156/1366/775 and AMD Socket AM3/AM3+/AM2/AM2+/FM2/FM1.

The first thing that should be noted about AXP-200 is that it’s a more powerful version of the predecessor, ready to dissipate heat even without the fan from all processors with TDP level of up to 35 W. The other peculiar thing is that the model comes at an attractive price of approximately €50. And finally, framework is one more feature that differentiates AXP-200 from rival products.

Thereby, the cooler from Thermalright has got C-shape framework …
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Registered at: 13 September 2012, 17:08
Last visit: 13 September 2012, 17:30