Toshiba to Release Entry-Level A100 Solid-State Drive

Toshiba is about to release a 2.5-inch SSD, entitled A100. The entry-level model is based on TLC NAND flash memory chips (15 nm) with the cooperation of SLC cache memory. Traditionally, the drive employs SATA 6 Gb/sec interface and takes Toshiba TC58NC1010 chip as a controller.



The greenhorn is available in two versions: 120 GB and 140 GB (dimensions: 100x69.85x7 mm). The couple is an optimal choice for home & office PCs, thanks to the incorporation of power-efficient, high-performance and shock-proof technologies. The drives’ maximal data transfer speed on sequential operations makes up 550 MB/sec & 480 MB/sec (read/write). The maximal data transfer speed on random operations (4K) achieves 87.000 IOPS & 82.000 IOPS correspondingly.


Toshiba A100 solid-state drives are known to support NCQ, TRIM and S.M.A.R.T. technologies. An estimated MTBF index equals to 1.5 million hours. The 120 GB item might endure 30 TB of written information, while the 240 GB item allows for 60 TB …

NZXT Develops a New Generation of Phantom Chassis

NZXT, a company known for the development of multifarious hardware products for gamers and PC enthusiasts, announced a new generation of chassis, supplementing Phantom series. The first model designed under new technologies is codenamed Phantom 820 and will go in Full-Tower form factor. The company promises that the new product will preserve 'gaming-like' external integration with futuristic design, transparent acrylic window with bright lighting, and angular casing lines.



NZXT Phantom 820 will be compatible with a range of motherboard standards, including uITX, mATX, ATX, E-ATX, and XL-ATX. Its dimensions allow for the integration of six 3.5/2.5-inch drives, four 5.25-inch drives, nine slots for expansion cards of PCI standard, and graphics adapters of up to 350 mm in length (with two HDD bays). There is also a possibility to install a water-cooling system instead of pre-installed air-cooling system.


The nominal delivery stipulates the installation of two 200 mm fans (one …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …
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