Top-Tier Chassis Zalman H1 Review

Zalman has long been deprived of a full-tower flagship PC chassis, after it discontinued the line of GS1200. The anticipation of a new etalon was accompanied by an overall market uncertainty as for the future of desktop platforms. Luckily, laptops and tablets couldn’t fully satisfy the customers’ growing needs, so Zalman decided to fire off with a new top-tier case, entitled H1. Stylish and magnetic from outside, this model has a lot of interesting options in the bins. Let’s have a look at them.



Key Features


Zalman H1 is a full-tower case, featuring 561x238x570 mm dimensions. The chassis is made of steel, aluminum and a high-quality plastic, with exterior and interior totally painted black. Internal layout allows for the installation of motherboards with elongated PCBs, including E-ATX and XL-ATX models. The model houses three external bays for 5.25-inch drives, seven internal bays for 2.5-/3.5-inch drives as well as nine expansion slots.


The case boasts some …

The Compulab IPC3 Mini-PC with Passive Cooling Goes for 693 USD

One of the latest products by Compulab is an IPC3 mini-PC, intended for industrial and commercial use. The lowest price of the basic model is 693 USD.



Outside dimensions of the framework are 160 х 190 х 40 mm. Due to its exterior construction the case provides overall passive cooling.


There’s a possibility to install 32 GB of RAM, a 2.5” storage drive, an M.2 2260 SSD and a couple of devices with an mSATA connector. The novelty features wireless interface adapters along with two USB 2.0, four USB 3.0, two Gigabit Ethernet, a DisplayPort 1.2, an HDMI 1.4a and an S/PDIF ports. However, special modules will be able to extend this set of connectors.


The Compulab IPC3 Mini-PC operates an Intel Kaby Lake CPU and is protected by the five-year manufacturer warranty.

Spire Showcases New Cylinder-Shaped Swirl IV CPU Cooler

Spire is going to release a new extraordinary cooling solution: a cylinder-shaped CPU cooler, entitled Swirl IV. It is targeting Intel processors for Socket 2011/1366/115x/775 and AMD FM1/FM2/AM2/AM3 platforms with the maximum TDP level of 130 W. The new-comer has received RoHS and CE certification that proves its environmentally-friendly nature. An official release is postponed to January 2015.



Spire Swirl IV features 131x125x62 mm dimensions and weighs 690 g. Its heatsink consists of 45 aluminum fins, pierced by three copper zinc-plated U-shaped heatpipes (8 mm). Inside the heatsink one can find a 60 mm fan with blue LED backlit. Its rotational speed is controlled by PWM technology so that the blades could run between 600 RPM up to 2000 RPM.


The fan is equipped with a slide bearing, estimated for 50.000 hours of fool-proof operation. It is powered by means of a 4-pin connector, ensuring up to 83.12 CFM airflow at 26 dB noise. Besides, at the highest rotational speed the …
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Location: Украина, Николаев
Registered at: 05 November 2011, 01:54
Last visit: 05 November 2011, 01:54