Motherboard ASUS ROG Maximus IX Formula Overview

ASUS ROG Maximus IX Formula occupies the top lines in the based on the newest chipsets motherboards’ family. The main specialties of this model are: a special supply chain radiator with integrated water-block, ROG Armor cover, the preset wireless network adapter. The engineers also paid more attention to the setting up and monitoring of the LSS.


Features:

• Chipset: Intel Z270 • Processor socket: Socket 1151 • Processors: Core i7, Core i5, Core i3, Pentium, Celeron (Skylake-S, Kaby Lake-S) • RAM: 4 DIMM DDR4 SDRAM 2133/2400/2666 * / 2800 * / 3000 * / 3200 * / 3300 * / 3333 * / 3400 * / 3466 * / 3600 * / 3733 * / 3866 * / 4000 * / 4133 * (OC) a maximum of 64 GB • PCI-E Slots: 2 x PCI Express 3.0x16 (x16 + x0, x8 + x8) 1xPCI Express 3.0 x16 (x4)3xPCI Express 3.0 x1 • M.2: 1 x PCI Express 3.0 x4 (Key M, 2242/2260/2280/22110) 1 x PCI Express 3.0 x4 (Key M, 2242/2260/2280) • Integrated graphics core (processor): Intel HD 510/530/610/630

• Video input: …

Thermalright Shows up a Hard-Hitting Archon IB-E X2 Cooler

Thermalright is about to release a new ‘tower’ CPU cooler, codenamed Archon IB-E X2. Featuring 155x106x170 mm dimensions, the model supports Intel LGA 2011/115x and AMD FM1/AM2+/AM3+/FM2+ platforms. The launch date is on hold, though the recommended price might rise up 65 EUR.



Thermalright Archon IB-E X2 consists of a voluminous aluminum heatsink with 43 thin pins, which are pierced by eight U-shape nickel-plated heatpipes, and a polished copper base also with a nickel-plated coverage.


The framework is replenished by two 140 mm fans Thermalright TY-141; they are thought to support PWM technology that promotes for speed variation from 900 RPM to 1300 RPM. The fan blades produce up to 74 CFM airflow, consuming not more than 2.4 W power. Average noise level fluctuates within the measures of 17-21 dB.


Moreover, the vendor equips the cooler with a brand thermal compound — Thermalright Chill Factor III. The latter transcends common Chill Factor item in terms of heat …

Cooler Master to Continue Its Series of Heatsinks with Vapor Chambers

Cooler Master has lately introduced its new lineup of coolers with the implementation of vapor chambers technology (TPC 812 series). However, the company's plans are not limited to this series only, and the upcoming release of V4 GT series is the most convincing proof of it. The new series will be based on horizontal vapor chamber technology and intended at the colling down of high-end graphics cards.



In accordance with the manufacturer's undertakings and plans, the implementation of this technology will provide for the octuple improvement of heat dispersion as compared with the solid copper-contact sink. This approach towards the processor's colling down enables the involvement of more heat pipes. Nevertheless, V4 GT model will be equipped with only four heat pipes.


Vapor chamber technology stipulates efficient removal of heat from the processor and other integral components. At the same time, it averts the creation of hot spots and promotes for the even distribution of …
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Registered at: 28 August 2012, 17:22
Last visit: 06 July 2013, 05:22