Intel to Take Care about Power-Efficiency of Ivy Bridge Processors

The rising competition between the two giants in the manufacture of processing units, Intel and AMD, makes each of the two invent ever newer technologies and implement them in their products. The attempts to dominate in the market and win as many consumers usually develop into brand new approaches and brand new advanced facilities.

In this light, Intel is going to upgrade its Ivy Bridge processors to make them more power-efficient. But power-efficiency does not imply that processing units will show less performance; quite the contrary, the manufacturer is willing to combine an utmost performance with the maximal power efficiency level.

Currently, the most power-saving processors of Ivy Bridge generation can be found in mobile devices on Windows platform and in Apple MacBook Air devices. Their TDP level is recorded at 17W. As appears from the above mentioned, the TDP level in upgraded Ivy Bridge processors will be lower than 17W, though the developers do not voice the margin …

Xeon Phi: Revolutionary Offer from Intel Developers

Intel Corporation has made a resolute step towards the improvement of performance demonstrated by ‘supercomputers’. Its new Intel Xeon Phi is called to create a real revolution in the IT world, offering unmatched performance showings on activities with the high parallelism degree. This is supposed to bring supercomputers to the new level by means of enlarging the performance levels from TFLOP to EXAFLOP. Upon the whole, Xeon Phi is the name which will be used for further line of products based on Intel MIC architecture.

Xeon Phi coprocessors are sure to enable the transmission of the reduced data via PCI slots and will primarily be applied to dedicated coprocessors. The sales start is designated to the end of the current year, and the first products presented in the market will be items which belong to Knights Corner series. According to the Intel developers’ words, Xeon Phi will firstly replenish the series of central processors Intel Xeon E5-2600/4600; further on, the …

3D-Media Player 3Q F370HW Review

The launch of 3D media players with two operational systems triggered a real sensation among all potential customer groups. Those media players offered high-performance and cost-effective solutions for home use which could not but rejoice enthusiasts and gamers. Developers from 3Q company introduce their new media player F370HW called to satisfy the needs of the most fastidious users. The player took some characteristics integrated in other products, although it’s able to offer a dozen of fresh solutions.

Design and Framework

Media player F370HW casing is made of aluminum, except of the clipboard which is made of opaque plastic. LED-display, localized under the board glass, maps the current operational mode and the icons of all connected devices. The lower part of the clipboard is equipped with a single power button with blue highlight. The rear board is the place for multiple slots and sockets: one can find SD/SDHC memory card slot, four USB 2.0 sockets for the …
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Registered at: 21 March 2011, 18:49
Last visit: 21 March 2011, 18:49