Greeting Versa H23 and H23 Window Cases from Thermaltake

Budget-oriented series of PC cases from Thermaltake has been replenished with two new models: Versa H23 and Versa H23 Window. The mere difference between the two enclosures is the availability of a side-faceted acrylic window in ‘Window’ version. Still, both mid-towers feature 429x209x491 mm dimensions and come with a totally black coating. Their internal spacing is sufficient to include standard ATX, as well as contracted micro-ATX motherboards.



Thermaltake Versa H23 and H23 Window boast two 5.25-inch, six 2.5-inch and three 3.5-inch trays for the installation of various drives. All of them might be mounted without any special tools, due to a polished clipping system. The cases offer seven PCI slots to expand the system’s functional.


Additionally, the models support the installation of CPU coolers of up to 156 mm in height, graphics cards of up to 315 mm in length, and a standard PS/2 power supply unit. The I/O panel is located in the top-front panel. It embraces …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …

Foxconn has changed specifications of nettop Nano AT-5250

Due to a sudden «retirement» of the processor Intel Atom D2700, Foxconn company was forced to make adjustments in the equipment of its compact desktop PC Nano AT-5250 on Intel platform. As a result, in its specifications, instead of old CPU, a new dual-core chip Intel Atom D2550 with a frequency of 1.83 GHz has been implemented. As for the version of the nettop, built on a platform of AMD, it is worth noting that its specifications remain the same. It should be mentioned, that here a dual-core accelerated processor AMD E-450 is a “heart” with 1.65 GHz of clock frequency. Its integrated graphics is AMD Radeon HD 6320.



Mini-PC weighs 600 grams, is performed in a black hull with dimensions of 190 x 135 x 38 mm, and is passively cooled.


Among other specifications, its arsenal can boast:

— 4*USB 2.0 ports, 2*USB 3.0 ports, one DVI port and HDMI;

— One SO-DIMM slot for location up to 4 GB of RAM DDR3;

— Bays for installation of one 2.5-inch and one 1.8-inch …
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Registered at: 18 March 2011, 16:02
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