Apacer Launches Memory Cards of SD and CF Format

Apacer Technology, world-known manufacturer of digital storage devices and memory cards, has introduced in a stately manner its latest ‘creations’, memory cards of SD and CF format, codenamed SD-M and CompactFlash5. The key feature of new products is the extended temperature range which allows the cards to show good operability under conditions of low temperatures (from -40 degrees centigrade) up to extremely high temperatures (to +85 degrees centigrade). The applied technology promoted for the expansion of these memory cards to a variety of areas, including aviation, military and automotive electronics.

According to the words of Apacer’s representatives, their memory cards are full-blown solid state drives with SD and CF interfaces. SD-M and CompactFlash5 are based on MLC NAND flash memory.

Memory cards with SD interface support SD 2.0 and Class 10 specifications, and will go in four volume capacity variants: 4, 8, 16, and 32 GB. Those cards are known to develop …

Aerocool Introduces New Gamers Enclosure XPredator X3

Aerocool has recently supplemented its PGS-B enclosure series with a new product – XPredator X3. This chassis is delivered in mid-tower format and supports motherboards of micro-ATX and ATX form-factor. It is mainly targeted at consumers who spend much of their time playing games or working with various applications. The new model goes in three color versions: White Edition where the chassis features white and black coloring, Devil Red Edition where red and black colors dominate, and Evil Black Edition where black color is combined with orange. The manufacturer equipped its chassis with LED lighting of blue, red and orange tints, depending on the predominant color.

Aerocool XPredator X3 casings are made of solid steel and go with grid-like clipboard. They are furnished with eight expansion slots, three 5.25 inch external bays, eight internal bays for 2.5 inch and 3.5 inch HDDs or SSDs. In addition, the top panel accommodates a special dock-station for the integration of a …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.

With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.

The initial stage of this program …
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Registered at: 10 August 2011, 19:39
Last visit: 11 August 2011, 01:56