New Mini-PC Foxconn AT-5570 from NanoPC Series

Foxconn introduces a new high-performance mini-PC intended basically at home media systems. Codenamed AT-5570, this computer is characterized by power-efficient, low-noise and compact (190x135x38 mm) properties. Thanks to a dedicated VESA fixing element, AT-5570 might be placed on a rear plate of TV-set or PC monitor; this will offer additional space on the working surface. All potential clients will find this PC either in black or silver casing coloring.



Mini-PC Foxconn AT-5570 is based on two-core AMD C-70 processor and employs AMD Radeon HD 7290 graphics core. The implemented graphics differs dramatically in terms of speed from Intel GMA built-in solutions which are frequently used in similar compact PCs. The model supports DirectX 11 technology and uses DVI/HDMI ports as imaging output; the customer is able to connect two monitors simultaneously to provide for better graphics effects.


The integrated CPU is notable by 9W TDP index that positively influences the warming …

The Tempered Glass Edition of the Thermaltake Core X71 Chassis

The Thermaltake Company has announced a new Core X71 version of chassis. This solution is called Tempered Glass Edition and is produced in black colour.



One of the novelty’s panels possesses a window out of 4 mm tempered glass instead of the formerly used acrylic panel.


Due to its dual-chamber structure the chassis has much of the inner space, which allows to assemble a PC of almost any complexity with the liquid cooling system utilization.

Motherboards of Mini ITX, Micro ATX and ATX typical sizes can be installed. The maximum number of expansion cards is eight. One can use discrete graphics accelerators of up to 420 mm length.


In the front part of this product, there is enough room to mount a 480 mm heatsink, and it’s possible to install a 360 mm heat dissipator at the top. The preassembled power supply unit length equals to 220 mm.


The dimensions of this full tower chassis by Thermaltake are the following: 677 × 250 × 511 mm.


Unfortunately, the …

AMD Highlights Plans for the Transition to the 28nm Process

AMD is a company known for the continual and elaborate work on the development and improvement of all product lines, as well as technological standards. Thus, the coming 2013 year is supposed to be portentous for the company in terms of the implementation of 28nm standards in their APU. AMD has recently voiced the plans for the change of the Trinity APU to a new model, codenamed Richland, and the transition to 28nm technological process.



The new APU, Richland, is presumably to be released in two versions: dual-core and quad-core. It will support a number of high-performance technologies, such as Blu-ray 3D, dual graphics, Open CL, AMD turbo core overclocking, and some others.


According to the preliminary information, Richland will employ FM2 socket (which Trinity employs) and Radeon 8000 series DirextX 11 GPU. This GPU will be furnished with 128 cores in dual-core model line, and with 384 cores in the high-end A10 APU. The same number of cores has been implemented in …
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Registered at: 23 March 2011, 16:05
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