Deepcool Launches the Follower of Big Frost Cooler

Deepcool, a Chinese supplier of various cooling systems, is going to release a follower of Big Frost model that saw the light last July. The new product has been given an attribute 'Extreme Edition' and is currently codenamed Big Frost Extreme Edition. This cooler takes the basis of the predecessor, though still features some unique options.

Therefore, Big Frost Extreme Edition is distinguished by a nickel coverage of copper heat pipes and polished base surface that is in direct touch with CPU lid. Deepcool equips its cooler with two 120 mm fans (UF120) which are monitored by PWM controller. Their maximal rotational speed is estimated at 1500 r/m. Both fans ensure the utmost CPU cooling and proper airflow distribution.

According to the preliminary data claimed by the manufacturer, Big Frost Extreme Edition will be compatible with such desktop platforms as AMD FM1, FM2, AM2/AM2+, AM3/AM3+ and Intel LGA2011, LGA1366, LGA115x.

One of the notable aspects ascribed to the …

Zalman Introduces Highly Efficient FX70 Passive Cooler

Zalman, a renowned South Korean designer of various hardware solutions, has recently introduced its latest CPU passive cooler, entitled FX70. The new-entry features 110x140x158 mm dimensions and comes without any fans. However, if there is a need to cool down CPUs with the TDP level higher than 80 W, the customer is free to enhance the facilities by adding two 120 mm fans. The latter are fixed to the heatsink by means of four brackets.

Zalman FX70 is an optimal choice for the following platforms: Intel LGA 2011/1366/115x/775 and AMD FM2/FM1/AM2/AM2+/AM3/AM3+. This cooler fits in any mid-tower ATX and larger PC chassis. The cooler’s framework consists of a copper base, pierced by six nickel-plated heatpipes, and of fifteen heatsink plates with an offbeat design, codenamed Twist; they are called to dramatically improve the process of heat management.

Fanless framework is regarded to be an advantage due to three reasons. First of all, pure heatsink provides absolutely no …

ARM Readies Cortex-A72 and Mali-T880 for Mobile Devices

ARM has just announced a series of solutions for the upcoming next-generation mobile SoC. The most notable developments are Cortex-A72 processor and Mali-T880 graphics. According to the manufacturer, both components will be interconnected within SoC by means of CoreLink – CCI-500. The launch of new items is scheduled for 2016. Rockchip, MediaTek and HiSilicon are among the companies to integrate both elaborations into their products.

It should be noted that Cortex- A72 is a successor of Cortex-A57, taking analogous 64-bit operations but demonstrating three times higher performance. The new-comer will be designed under 16 nm FinFET+ technological process. Its layout corresponds to big.LITTLE framework requirements; this promotes for its combination with other ARM cores.

As far as Mali-T880 GPU is concerned, it provides for 1.8 response time increase if compared with the Mali-T760 model. Herewith, its power consumption is reduced by 40%. Moreover, this GPU might support 4K …
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Registered at: 22 November 2011, 23:35
Last visit: 01 December 2011, 22:45