Release of Security Acceleration Module from Check Point

Check Point representatives have announced the release of their new creation Security Acceleration module. This module has been developed with the heightened security in mind, and according to the up-to-date hardware acceleration methodology with the consideration of the requirements stipulated by the high-performance environment.

Check Point is notable for the design of an advanced SecurityCore hardware-based technology which stimulated the development of a module with the firewall bandwidth of 110 Gbit/sec. At the same time, the latency level doesn’t exceed the margin of 5 microseconds. This technology employs parallel computing capabilities used for the process acceleration and safety. The module is equipped with 108 cores which allow the central processor to swap-out and transfer the vast majority of operations connected with the security issues to the Security Acceleration module. In its turn, this provides for the better safety options in network environment.

ASRock to Release BeeBox Mini-PC with Type-C Interface

ASRock has replenished its series of Intel NUC mini-PCs with a new model – the BeeBox. Its key peculiarity is the support for USB Type-C interface. The model features 118.5x110x46 mm dimensions, satisfying basic corporate and home entertainment needs. In addition, it boasts low power consumption level combined with a strong performance.

ASRock BeeBox will be available in three versions: as a barebone PC, a full-blown system without OS and a full-blown system with OS. Each version will be housed either in a classic black, a stylish gold or a pure white chassis.

The heart of the model is Intel Braswell platform (64-bit, 14 nm) equipped with a two-core Celeron N3000 CPU, running at 1.04/2.08 GHz frequency (basic/dynamic). There will be versions with a four-core Celeron N3150 CPU. Both processors feature 4/6 TDP only. Besides, all computers come with an integrated Intel HD graphics.

The platform is also furnished with 2.4 GB of DDR3L-1600 MHz RAM (maximum up to 16 GB …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.

With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.

The initial stage of this program …
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Registered at: 11 January 2012, 10:46
Last visit: 11 January 2012, 17:48