Antec Announces Classic P70 PC Case

Antec, a well-known multi-profile hardware designer, is about to release its newest mid-tower case, entitled P70. The model attracts attention by a strict classic design with a solid steel framework, polycarbonate coating, and low noise level. Featuring 458x205x465 mm dimensions, it supports as mini-ITX/micro-ATX mainboards, so full-format ATX ones. The recommended retail price will probably make up $70.



Antec P70 comes with two external 5.25-inch bays, one external 3.5-inch bay as well as four 3.5/2.5-inch internal bays for HDD/SSD. Expansion facilities are backed by seven slots. It should be underlined that all drives and cards might be installed without accessory tools due to the implementation of a tool-free mounting system. With flexibility of application in mind, HDD bays are rotated 90 degrees.


The case is able to accommodate graphics cards of up to 380 mm in length, ATX power supply units, and CPU coolers of up to 170 mm in height. Top I/O panel cannot boast any …

Enermax Equips NAXN ADV Units with Flat Cables

Enermax, a well-known manufacturer of various PC components, has recently introduced a new line of power supply units that are considered to be a more elaborate follower of NAXN series launched in 2011. A new line has been entitled NAXN ADV and already acquired 80 Plus Bronze certificate. Models, that entered the series, inherited a lot of similar features from their predecessors, nonetheless, they can boast a range of distinguishing parameters.



Thus, one of the most peculiar features pertained to NAXN ADV units is the implementation of absolutely flat cables, including the main power cable with 24-pin connector, cables with PCI Express connectors for 3D cards, as well as cables with sockets for the connection of drives.


Besides flat structure, all cables are quite flexible. According to the manufacturer's words, such layout facilitates their mounting and eliminates the problem of their confusion within the case. In its turn, proper cable management enhances the airflow …

Welcome In New LPDDR4 Memory Chips from Samsung

Samsung settles down to a large-scale production of LPDDR4 mobile memory chips. Elaborated according to 20 nm technological norms, the new-comers boast the integration of an advanced technology that ensures 8 Gb crystal density and twice the performance compared with LPDDR3 chips. Currently, the company produces models of 2 GB and 3 GB capacity, however in early 2015 it will set to the development of 4 GB solutions.



New LPDDR4 memory modules are targeting various mobile devices with thirst for lightning-fast data transfer speed. The latter index might accelerate up to 3200 Mb/sec; this will allow employing chips for the implementation of resource-intensive tasks, such as recording and playback of high-resolution video or serial filming.


Samsung developers claim that 2 GB LPDDR4 DRAM is 40% more power-efficient than counterparts with 4 Gb crystal density. This became possible due to the adopting of low-voltage swing-terminated logic for I/O signaling. As a result, the …
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Registered at: 05 April 2012, 00:53
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