Release of Low-Profile Cooler Slim Silence A-Plus from Gelid

Gelid Solutions, a Hong-Kong based renowned manufacturer of thermal solutions and other PC hardware, has lately presented its low-profile CPU cooler, codenamed Slim Silence A-Plus, for AMD platform. The new cooler is compatible with AMD AM2(+), AM3(+), as well as, FM1. According to the words of the Asian manufacturer, this model is capable to manage processors with the TDP index fluctuating in the measures of 95W.

There is one peculiar feature about Slim Silence A-Plus: its design resembles the design of coolers destined for GPU due to the foveate fan. That is why, customers can sometimes confuse this cooler's destination.

CPU cooler Slim Silence A-Plus goes in rather compact dimensions; its height does not exceed 28 mm, while its weight equals to 282 g. Such compactness provides for its unimpeded installation into chassis of different form-factor, starting from Mid-Tower, and finishing with Mini-ATX, 1U and HTPC.

The cooler's casing consists of an aluminum radiator …

Next year TSMC will start manufacturing the first 20nm chips

The Taiwanese company TSMC confirmed its intention to start production of chips using 20 nm technological processes in 2013. However, for now the company does not plan its production on an industrial scale and will release the first chips in a limited quantities, giving them a total of 1% of production capacity. According to the head of the company, the mass production of semiconductor chips with this technology will not begin until 2014.

Meanwhile TSMC Company is going to produce only one version of the chip, which will be able to enter into the wide range of devices, from smart phones with low-power to high-performance graphics cards. For comparison, the Taiwanese company currently has four different output chips on 28-nm technology. These are 28LP (poly / SiON) for low-power low-cost chips, 28HPL (HKMG) for use in low power applications, 28HP (HKMG) for high-performance chips and 28HPM (HKMG). The latest version combines elements of high-performance chips with high efficiency …

Ultrabook Lenovo ThinkPad X1 Carbon will debut on August 21

In May this year, Lenovo, HP, along with being the largest manufacturer of branded PCs, has announced plans to release 14-inch ultrabook premium-level ThinkPad X1 Carbon. In order to attract affluent buyers who are in search of a fashion mini-PC, the frame and lid are made of CFRP (carbon fiber) — lightweight and durable material that is used, including in the aerospace industry, and expensive cars. Due to this, the thickness of the laptop is reduced to 17.7 mm, and weights — up to 1.36 kg.

Screen of Lenovo ThinkPad X1 Carbon has a resolution of 1600x900 pixels, a maximum brightness of 300 and wide viewing angles. Graphic system is presented by built Adapter Intel HD 4000 into the processor Ivy Bridge. RAM is 4 GB and can be expanded up to 8 GB. Keyboard ThinkPad Precision doesn’t have numeric keypad, but it has an LED backlight.

In addition, the novelty has a webcam 720p, battery with a resource of battery life of up to 6 h 20 min., fingerprint scanner, connectors …
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Registered at: 08 March 2013, 09:38
Last visit: 09 March 2013, 16:15