CPU Cooling System Scythe Katana 4 Review

Cooling systems supplied by Japanese manufacturer Scythe are distinguished by the tilted radiators. The latest CPU Katana 4 cooler is not an exception: it is notable for the unusual shape of the radiator. This product is going to compete for mass audience in middle-end market segment, since its price is estimated not for inveterate gamers or overclockers but for users with common cooling needs. Scythe Katana 4 will be a perfect match for average PC systems intended at efficient central processor airflow.

Basic Specifications

The first, and most striking, distinguishing feature of Scythe Katana 4 is its compatibility with a large number of Intel/AMD processor sockets. Even the systems with outdated sockets can hope placing this cooler model. The list of supported sockets include: Intel LGA 775, 2011, 1366, 1155, 1156, and AMD FM1, AM2/AM2+, AM3/AM3+, 940, 939 and 754. Other specifications of the model are listed below:

— dimensions: 100x102.5x143 mm, weight – 480 g;
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Lifting the Veil from USB Type-C Bus

Since the launch in 1995, Universal Serial Bus (USB) has proved itself as the most successful ever computing interface. Nowadays tens of billions of electronic devices are connected together due to it. It goes without saying that this bus has outlived a few modifications, each distinguished by higher speed and reliability. Thus, today the community is able to revel in a completely new modification – USB Type-C – that forecasts a lot privileges of connectivity process. Let’s see what users will get with a new bus.

Layout and Connectivity

In physical terms, Type-C is a bit larger than USB 2.0 Micro-B but a bit tinier than binary USB 3.0 Micro-B, featuring 8.34x2.56 mm. Such dimensions enable its connection to the devices of any type, including the thinnest smartphones/tablets. The oval-shaped socket houses 24 contact outputs (to compare: USB 3.0 sockets feature only 9 outputs).

The most outstanding physical peculiarity of Type-C is a symmetric connector that …

Cooler Master to Continue Its Series of Heatsinks with Vapor Chambers

Cooler Master has lately introduced its new lineup of coolers with the implementation of vapor chambers technology (TPC 812 series). However, the company's plans are not limited to this series only, and the upcoming release of V4 GT series is the most convincing proof of it. The new series will be based on horizontal vapor chamber technology and intended at the colling down of high-end graphics cards.

In accordance with the manufacturer's undertakings and plans, the implementation of this technology will provide for the octuple improvement of heat dispersion as compared with the solid copper-contact sink. This approach towards the processor's colling down enables the involvement of more heat pipes. Nevertheless, V4 GT model will be equipped with only four heat pipes.

Vapor chamber technology stipulates efficient removal of heat from the processor and other integral components. At the same time, it averts the creation of hot spots and promotes for the even distribution of …
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Registered at: 19 September 2012, 10:32
Last visit: 19 September 2012, 10:32