Lian Li to Combine Performance with Compact Size

Chassis of Full-Tower form-factor usually have solid framework due to the layout scheme and the necessity to enclose a lot of components. Developers from Lian Li company have totally demolished the current tendencies and announced the release of their PC-V750 Full-Tower model with the front-end PSU localization. This allowed the designers to dramatically decrement the size of the chassis without sacrificing its capacity and general specifications. The compact size of the chassis is considered to be a kind of ‘revolution’ in the market, since it is compatible not only with ATX and microATX motherboards, but also with Extended-ATX boards.



Lian Li PC-V750 casing is made of aluminum and approximates 7.35 kg in weight. Its dimensions provide for the installation of massive CPU-coolers (up to 170 mm in height), up to ten expansion cards, including 380 mm 3D cards. The chassis is equipped with five fans of 120 mm each: the two fans are located on the front plate, the other two – …

Thermaltake Enters the Market with NiC L31 and L32 CPU Coolers

Thermaltake Technology has just started shipping a pair of budgetary CPU coolers from NiC series. Entitled NiC L31 and NiC L32, these two models are compatible with all updated Intel and AMD platform motherboards. In keeping with the manufacturer, the new-comers will not obstruct the mounting of memory modules, due to their well-considered framework. Hence, they consist of small-sized heatsinks, three U-shape heatpipes (8 mm), and a base that is in direct contact with the CPU.



The first model, NiC L31 (codename: CL-P001-AL12RE-A), features 140x128x40 mm dimensions and weighs 530 g. The integrated 120 mm fan might operate in various speed modes – from 500 RPM to 1800 RPM – thanks to the support for PWM technology. It produces up to 70.99 CFM and dissipates up to 160 W power.


At the same time, at the minimal speed mode it generates only 18 dB noise, however at the ultimate rotations this index rises to 34.8 dB. According to the results of multiple tests, this fan is …

AMD Announces the Development of Steamroller

Heightened demand for high-end processor solutions and ever rising competition make AMD constantly develop its products. This usually results in the release of really outstanding items, such as already acknowledged Bulldozer and Piledriver. Therefore, according to the words of the companies technical manager, Mark Papermaster, the development of a new processor architecture, codenamed Steamroller, is already on order of AMD's business. The ready-made products are sure to be released next year. Steamroller is called to become the third edition of Bulldozer architecture that launched last year and a loyal companion of Piledriver core.



The initial data witness that processors on Steamroller architecture will be designed in correspondence with 28 nm technological process. This should favorably affect their efficiency and enlarge the performance by 15-20% at equivalent power consumption and clock frequency. At the same time, Steamroller will improve all specifications implemented in …
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