PSU Aerocool Templarius Imperator 750 Review

At turn of the previous year Aerocool launched a new series of PSUs, united within a single series Templarius Imperator. The series involves a line of models ranging 550W-1500W power index. A part of those units are known to correspond to 80Plus Silver standards, while the other part – to 80Plus Bronze standards. Model Templarius Imperator 750 complies with 80Plus Silver requirements, due to the claimed efficiency of 88%. This feature implies that this PSU might appear to be helpful in the assembling of quite powerful PC platforms.



Delivery Set and Exterior Design


Aerocool Templarius Imperator is delivered in a white cardbox which inscriptions distinctly make out about the unit’s gaming predestination. Its internal contents involve the unit itself and a set of modular cables. The model is developed in white color design and is housed in a steel case; it features 170x150x85 mm dimensions. Modular sockets are located on the rear facet. The attached label contains basic …

Liquid-Cooling System Zalman LQ315 Review

A few months after the last release of water-cooling systems, Zalman introduces a new series of products with a title attribute LQ3xx. The series consists of three models, LQ320, LQ315 and LQ310, which differentiate themselves primarily by dimensions. The senior cooler (LQ320) features 32 mm water block and 52 mm heatsink, the medium LQ315 cooler features 38 mm heatsink and analogous in dimensions water block; the junior cooler (LQ310) is the tiniest one and features 28 mm heatsink and water block. Zalman LQ315 greatly resembles its predecessor, CNPS20LQ, in design, however, is ready to offer some improved options, if compared with the previous cooler generations.



Design and Framework


Like any other water-cooling system, Zalman LQ315 consists of a water block combined with a pump and joined with a heatsink by means of flexible tubes. The water block is notable by the availability of 'Z' logo on its surface that is lighted blue during operation. Its round base, made of …

Intel Broadwell CPUs will Get BGA Casing

The Internet community is energetically discussing unofficial info concerning the future Intel's Broadwell processors. According to the yet unacknowledged data, Intel will branch off from currently traditional LGA casings in favor to a more advanced BGA solution. At present all CPUs designed by Intel specifically for desktop platforms feature LGA (Land Grid Array) casings which allow the users to upgrade their systems without any hassle. On LGA implementation, the chip is housed within a socket and contacts with the motherboard. As a result, the user might change one chip to the other only with similar set of contacts.



The launch of Intel Broadwell processors, which is planned for 2014, might dramatically change the situation for customers. Most probably Intel will refuse from LGA casings and accommodate all new CPUs in BGA ones, marking the change of Haswell generation to the future Broadwell generation developed under 14 nm technological process. BGA (Ball Grid Array) …
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Registered at: 26 May 2012, 23:23
Last visit: 10 June 2012, 14:24