Spire Debuts with Gaming PC Chassis X2.6019

Spire Corporation put itself on record with a new gaming PC chassis, codenamed X2.6019. The new-comer is developed in mid-tower form-factor, featuring 520x215x508 mm dimensions, and is made of 0.6 mm cold-rolled galvanized steel (SECC). Despite medium dimensions, it might easily accommodate motherboards of miniITX, microATX and ATX standard. According to Spire, this model belongs to MOD solutions, since it ensures an easy access to the hardware components during modification or update of the system.



Spire X2.6019 houses four external bays for 5.25-inch drives, six internal bays for 3.5-inch drives, as well as seven slots for PCI expansion cards. Its internal layout is divided by linear plates into three sections; such framework promotes for a better heat removal. It should be mentioned that this chassis is able to lodge nearly any CPU cooler and any high-end graphics card. Moreover, drive mounting can be realized without any dedicated tools.


To continue, this PC chassis …

Lian Li Launches New Full-Tower Chassis PC-A79

Lian Li has recently launched a new PC chassis, entitled PC-A79. The chassis is designed in full-tower format, featuring 230x618x596 mm dimensions. As a result, it supports a full range of motherboard standards, including micro-ATX, ATX, E-ATX, XL-ATX, and HPTX. According to Lian Li, the product is distinguished primarily by a well-considered cooling system and the availability of a removable motherboard tray. All potential customers are free to choose between a black variation (PC-A79B) and a silver variation (PC-A79A).



The case of PC-A79 chassis is made of brushed aluminum. Its spaciousness can’t but be distinct from similar products offered by competitors. Hence, it is able to accommodate nine drives of 3.5-inch standard and eight drives of 2.5-inch standard; all of them might be adjusted without any tools. The availability of eleven expansion slots provides for the installation of several lengthy graphics cards (up to 350 mm). The maximal height of supported CPU coolers …

Intel Broadwell CPUs will Get BGA Casing

The Internet community is energetically discussing unofficial info concerning the future Intel's Broadwell processors. According to the yet unacknowledged data, Intel will branch off from currently traditional LGA casings in favor to a more advanced BGA solution. At present all CPUs designed by Intel specifically for desktop platforms feature LGA (Land Grid Array) casings which allow the users to upgrade their systems without any hassle. On LGA implementation, the chip is housed within a socket and contacts with the motherboard. As a result, the user might change one chip to the other only with similar set of contacts.



The launch of Intel Broadwell processors, which is planned for 2014, might dramatically change the situation for customers. Most probably Intel will refuse from LGA casings and accommodate all new CPUs in BGA ones, marking the change of Haswell generation to the future Broadwell generation developed under 14 nm technological process. BGA (Ball Grid Array) …
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Registered at: 12 March 2011, 18:48
Last visit: 12 March 2011, 18:48