VIA Announces the Upcoming Release of VAB-800 Motherboard

VIA Technologies Inc., a global manufacturer of power-efficient processor platforms, has recently announced the release of its peculiar motherboard, codenamed VAB-800. The major peculiarity of these motherboards is that they will be delivered in two variants: with chips of VIA personal production, WonderMedia (800 MHz), and with Freescale ARM Cortex-A8 1 GHz chips. The volume capacities of DDR3 memory in either variant will equal to 1 GB. VAB-800 is developed in piro-ITX form-factor but is also compatible with blocks of ATX form-factor.



Motherboard VAB-800 accommodates flash-memory of eMMC type with the integrated SATA 3 Gbit/sec sockets. The total volume capacity of flash-memory equals to 64 GB. This model can boast a large number of internal sockets, including a couple of RS-232, two LVDS (to enable the connection with the up-to-date monitors), SATA, JTAG, SDIO, RTC, and a slot for the activation of the external power supply.


The manufacturer has taken care of the …

Gigabyte Intros GA-J1800N-D2PH Motherboard

Gigabyte is set to unveil in the European market its latest mini-ITX motherboard, codenamed GA-J1800N-D2PH. Featuring 170x170 mm dimensions, the greenhorn is targeting small-sized entry-level desktop PCs. It boasts Ultra Durable 4 Plus hardware base with high-quality components on board. European customers will be able to acquire this model for a price tag of 50 EUR.



Unlike the majority of rival solutions, Gigabyte GA-J1800N-D2PH already comes equipped with a CPU: Intel Celeron (Bay Trail-D), 2.41 GHz nominal frequency, 2.58 GHz dynamic frequency, 1 MB cache L2, integrated Intel HD Graphics 4000 with 792 MHz frequency, 10 W TDP. Due to low power consumption, it might be cooled by a passive cooler.


The motherboard accommodates two SO-DIMM slots for the installation of two-channel DDR3L-1333 MHz memory modules (up to 8 GB). Its other facilities include a pair of SATA II 3 Gb/sec ports, a single PCI slot, one USB 3.0 and four USB 2.0 ports, one gigabit Ethernet port, …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …
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