Thermalright Shows up a Hard-Hitting Archon IB-E X2 Cooler

Thermalright is about to release a new ‘tower’ CPU cooler, codenamed Archon IB-E X2. Featuring 155x106x170 mm dimensions, the model supports Intel LGA 2011/115x and AMD FM1/AM2+/AM3+/FM2+ platforms. The launch date is on hold, though the recommended price might rise up 65 EUR.

Thermalright Archon IB-E X2 consists of a voluminous aluminum heatsink with 43 thin pins, which are pierced by eight U-shape nickel-plated heatpipes, and a polished copper base also with a nickel-plated coverage.

The framework is replenished by two 140 mm fans Thermalright TY-141; they are thought to support PWM technology that promotes for speed variation from 900 RPM to 1300 RPM. The fan blades produce up to 74 CFM airflow, consuming not more than 2.4 W power. Average noise level fluctuates within the measures of 17-21 dB.

Moreover, the vendor equips the cooler with a brand thermal compound — Thermalright Chill Factor III. The latter transcends common Chill Factor item in terms of heat …

The growth of laptop shipments in the second quarter was 5%

Global laptop shipments have faced with glut stocks in March and a weakening global economy in May. That caused the situation of reaching a growth of supply in the second quarter of the year only for 5% compared with the previous, and it fell by 1.8% compared with this period year ago. Shipments totalled just over 50 million units, according to analysts.

Numbers of Acer and Lenovo laptop shipments were at the average level on the world market in comparison the first quarter of the year. Shipments of mobile PCs from HP, Dell and Toshiba have fallen to 4-7%. Most of all with the increase of supply by 36% managed its shipment the ASUS Company.

It is interesting that HP may soon lose its title of leader in the laptop market — China's Lenovo breathes down its neck, lagging behind only with 500,000 units. ASUS surpassed Dell, becoming the fourth largest producer of mobile PCs in the world with a share of 11.3%, and Apple and Samsung are in the seventh and eighth places …

Company XFX is preparing Radeon HD 7970 GE with Double Dissipation cooler

American vendor XFX is about two weeks to release a Radeon 7970 Edition Double Dissipation (model code — FX-797G-TDF). It combines the capabilities of GPU Tahiti XT2 with a higher overclocking potential and the TDP, rather than at Tahiti XT, PCB reference design, but without a single phase power supply (6 +1), and the cooling system in the vaporizing chamber, an array of aluminum fins, PA plate (the same heatsink for the VRM and memory), as well as the two fans standard size 90 mm.

New model will get the recommended for the Radeon HD 7970 GE frequency ratio 1000/6000 MHz for core and chips GDDR5. The graphics chip will operate at 1050 MHz in the load. Recall that the “usual” HD 7970 was limited to regular frequencies 925/5500 MHz and did not support dynamic overclocking.

The configuration of video outputs is almost standard: from the five of DVI-I, DVI-D, HDMI and 2x Mini DisplayPort for some reason excluded DVI-D. The additional power is supplied by one 8-pin and one …
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Registered at: 24 November 2011, 16:43
Last visit: 04 March 2012, 12:43