Foremay 2TB SSD: Reality for Industrial and Critical Systems

SSD segment has been characterized by a violent development from the very appearance of small-sized drives. Nonetheless, Foremay has managed to accelerate this development by announcing two new SSD lines housed in compact cases and featuring a truly striking capacity. About two years ago, the company released the models of 1TB capacity, but today it's claiming the coming release of models featuring 2TB capacity. Not all HDD products can nowadays boast such volumes, but Foremay was lucky to combine the size with capacity.



The first SSD line will be entitled SC199 and will serve the needs of critical applications. The second line is known to be codenamed TC166 and intended at industrial employment. All models are designed in 2.5-inch form-factor and employ SATA 6Gb/sec interface for the connection with various PC and computing systems.


According to Jack Winters, one of the Foremay's founders and promoters, the company implemented some new technological developments to …

Intel Compute Stick With Intel Apollo Lake CPU

In the year of 2015 the Intel Company announced a mini PC with a completely new layout, named Intel Compute Stick. According to its dimensions it resembles a mobile 3G adapter or a slightly enlarged typical flash drive, though its functionality lets us consider this sample to be a fully-featured PC, which only needs to be connected to the monitor or TV-set through the HDMI interface.



At first the Intel Company and its partners released their versions with Intel Bay Trail CPUs, being later exchanged by the Intel Cherry Trail series solutions. In 2016 even more powerful models with Intel Core m3 and Intel Core m5 (Intel Skylake) CPUs appeared. One can expect, that in the second quarter of 2017 the Intel Compute Stick manufacturers will use the Intel Apollo Lake series chips.


At least two new Intel Compute Stick versions are to be released. The first model will feature 2 GB of RAM, 32 GB of ROM eMMC memory and the pre-set 64-bit Windows 10 Home OS. The second version will …

Cooler Master to Continue Its Series of Heatsinks with Vapor Chambers

Cooler Master has lately introduced its new lineup of coolers with the implementation of vapor chambers technology (TPC 812 series). However, the company's plans are not limited to this series only, and the upcoming release of V4 GT series is the most convincing proof of it. The new series will be based on horizontal vapor chamber technology and intended at the colling down of high-end graphics cards.



In accordance with the manufacturer's undertakings and plans, the implementation of this technology will provide for the octuple improvement of heat dispersion as compared with the solid copper-contact sink. This approach towards the processor's colling down enables the involvement of more heat pipes. Nevertheless, V4 GT model will be equipped with only four heat pipes.


Vapor chamber technology stipulates efficient removal of heat from the processor and other integral components. At the same time, it averts the creation of hot spots and promotes for the even distribution of …
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