Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.

With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.

The initial stage of this program …

Thermalright Readies Le Grand Macho Passive Cooler

Thermalright decided to gladden all devotees of ultra-quiet PC systems by designing an efficient passive cooler – Le Grand Macho. This is a conventional tower cooler, supporting new and outdated CPUs of up to 95 W TDP. Hence, the greenhorn is compatible with Intel LGA 775/115x/1366/2011/2011-3 as well as AMD FM2/FM2+/FM1/AM2/AM2+/AM3/AM3+ platforms.

Initially, Thermalright Le Grand Macho is void of any fan; nonetheless, its framework presupposes the installation of one or two high-efficiency fans (120/140 mm), which are able to cope with 300-watt CPUs.

The cooler consists of a nickel-plated base, seven heatpipes and a voluminous aluminum heatsink with 35 fins. The latter come with perforations which counteract air between the plates with low air resistance. The base features a convex-shaped contact surface (that optimizes cooling efficiency) and is perfectly polished. Seven 6-mm heatpipes are solidly integrated into the base, ensuring ideal heat dissipation.

The …

Thermaltake Enters the Market with NiC L31 and L32 CPU Coolers

Thermaltake Technology has just started shipping a pair of budgetary CPU coolers from NiC series. Entitled NiC L31 and NiC L32, these two models are compatible with all updated Intel and AMD platform motherboards. In keeping with the manufacturer, the new-comers will not obstruct the mounting of memory modules, due to their well-considered framework. Hence, they consist of small-sized heatsinks, three U-shape heatpipes (8 mm), and a base that is in direct contact with the CPU.

The first model, NiC L31 (codename: CL-P001-AL12RE-A), features 140x128x40 mm dimensions and weighs 530 g. The integrated 120 mm fan might operate in various speed modes – from 500 RPM to 1800 RPM – thanks to the support for PWM technology. It produces up to 70.99 CFM and dissipates up to 160 W power.

At the same time, at the minimal speed mode it generates only 18 dB noise, however at the ultimate rotations this index rises to 34.8 dB. According to the results of multiple tests, this fan is …
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Registered at: 25 October 2012, 15:10
Last visit: 25 October 2012, 15:19