Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …

Crucial Showcases Voluminous MX300 Solid-State Drives

Crucial is about to launch a new series of voluminous SSDs, entitled MX300. The lineup consists of 2.5-inch models with thin cases (7 mm only), targeting as desktop so mobile platforms. Additionally, the delivery set offers a dedicated 2.5-inch frame for the installation into a 9.5-inch bay. The capacity of drives makes up 275 GB, 525 GB, 750 GB, 1 TB, and 2 TB.



SSDs Crucial MX300 is developed on 32-layer Micron 3D NAND TLC chips (48 GB) as well as Marvell 88SS1074 controller. Data transfer process is realized via SATA III (6 Gb/sec) interface. The maximal sequential Read/Write speed equals to 530 MB/sec/510 MB/sec. In its turn, the maximal random data transfer index approximates 83.000/92.000 IOPS (Read/Write).


The greenhorns are thought to support the following technologies: AES, ECC, T.R.I.M., Data Path Protection, S.M.A.R.T., Active Garbage Collection, Power Loss Prevention, and Extreme Energy Efficiency. Besides, Dynamic Write Acceleration identifies and writes the …

Akasa Intros Low-Profile CPU Cooler Nero LX

Akasa, a global manufacturer of chassis, PSUs, and PC peripheral components, introduces its new low-profile cooling system, codenamed Nero LX. The new product is intended specifically to provide the maximal cooling effect to CPU and its surrounding elements. Nero LX might be employed in HTPC and slimmer PC systems. Detailed specifications about this cooler have just appeared at the manufacturer's official website, however pricing info has not been revealed yet.



Akasa Nero LX features 120x120x59 mm dimensions and weighs 298 g. The overall cooler's framework consists of a 120 mm fan, a large base, and four copper heat pipes that pierce an aluminum heatsink. The cooler employs an advanced scheme of direct contact of heatpipes with CPU surface which promotes for the utmost cooling environment.


This model is compatible with a majority of processor sockets developed by AMD and Intel. Hence, it supports Socket FM1, AM2, AM2+, AM3 from AMD, and LGA 1366, 1156, 1155, and 775 from …
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Registered at: 31 December 2011, 23:22
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