CPU Cooling System Scythe Mugen 3 Rev. B PCGH Edition Review

With the appearance of ever mighty CPUs that demonstrate utmost performance and overclocking properties, the call for powerful cooling systems has become rather acute. It is explained by the necessity to efficiently manage high temperatures and save the system from overheating, and as a result, from malfunctioning. At the same time, customers became more demanding as for the noise level of coolers. That is why, many companies try to comply with the prevailing tendencies by delivering low-noise and high-efficient products. CPU cooler Scythe Mugen 3 Rev. B PCGH Edition is ready to offer all required facilities to be implemented in high-end computer systems.



General Framework Peculiarities


The postfix PCGH Edition in the codename of this CPU cooling system implies the employment of two fans in the framework. The basic technological peculiarity of this model is that both fans are rotated at constant speed (800 rpm), as compared to the one-fan systems where rotational speed …

Asus Launches Overclocking-Oriented TUF Sabertooth 990FX R3.0 Mainboard

Despite the fact that Socket AM3+ platform is on its last legs, Asus still dares developing an advanced motherboard, designed for AMD FX processors. That is how TUF Sabertooth 990FX R3.0 board made appearance. The ATX model is built on the binder of AMD 990FX + SB950 bridges as well as a 8+2-phase Asus Digi+ VRM system. The PCB boasts the implementation of top-tier TUF Components hardware base.



Asus TUF Sabertooth 990FX R3.0 is furnished with a voluminous heatsink on key elements; it ensures stable operation even on overclocking. Functionality of the motherboard is realized thanks to M.2 Socket 3 slot with the bandwidth rate of 20 Gb/sec. There are three PCI-e x 16 ports for the connection of graphics cards and other expansion cards; there are also two PCI-e 2.0 x 1 slots & a single PCI-e 2.0 x16 slot.


The model features Realtek ALC1150 audio controller (+ 5x audio connectors) as well as gigabit Ethernet Intel I211 controller. The connection of peripherals is ensured via …

Welcome In New LPDDR4 Memory Chips from Samsung

Samsung settles down to a large-scale production of LPDDR4 mobile memory chips. Elaborated according to 20 nm technological norms, the new-comers boast the integration of an advanced technology that ensures 8 Gb crystal density and twice the performance compared with LPDDR3 chips. Currently, the company produces models of 2 GB and 3 GB capacity, however in early 2015 it will set to the development of 4 GB solutions.



New LPDDR4 memory modules are targeting various mobile devices with thirst for lightning-fast data transfer speed. The latter index might accelerate up to 3200 Mb/sec; this will allow employing chips for the implementation of resource-intensive tasks, such as recording and playback of high-resolution video or serial filming.


Samsung developers claim that 2 GB LPDDR4 DRAM is 40% more power-efficient than counterparts with 4 Gb crystal density. This became possible due to the adopting of low-voltage swing-terminated logic for I/O signaling. As a result, the …
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Registered at: 09 January 2012, 12:48
Last visit: 09 January 2012, 12:52