Sapphire Unveils Small-Sized R9 285 2GB GDDR5 ITX Compact Edition Graphics Cards

Optimized energy efficiency offered by AMD Radeon R9 285 graphics adapters has become a key factor for Sapphire to elaborate a pair of original proprietary versions. The new-comers, codenamed R9 285 2GB GDDR5 ITX Compact Edition, are targeting mini-ITX systems with huge performance ambitions. The pair traditionally involves a standard model with etalon specifications and OC model with a factory overclocking.



Both graphics cards employ a small-sized two-slot cooler that consists of a compact heatsink, four copper heatpipes, and a single fan of 100 mm dimensional type. Connection with PC monitors and other visual solutions is realized by means of HDMI, DVI-I, and a couple of mini-DisplayPorts. Additionally, the models feature dual BIOS chips (standard and UEFI) which might be switched with the help of a dedicated key on the case.


To continue, Sapphire R9 285 2GB GDDR5 ITX Compact Edition and OC Edition are based on AMT Tonga GPU (28 nm, GCN) with 1792 stream processors, 112 …

Universal CPU Cooler Zalman CNPS9900DF Review

Zalman keeps on developing high-end cooling systems with a radial arrangement of plates. Its latest product, CPU cooler CNPS9900DF, is considered to be universal in terms of compatibility and implemented facilities. Still, some IT experts view this model as a modification of previously launched Zalman CNPS9900 MAX, although with two fans. In spite of visual resemblance, the company tried to design a truly uncommon cooler, with remarkable specifications and reliability.



Framework Peculiarities


Zalman CNPS9900DF is distinguished by an unusual framework. It's not a traditional vertical tower, as long as heatsink ribs feature fan-like location relative to the central axis of symmetry. Such approach provides for a comprehensive heat dissipation over all key motherboard components due to absence of frames on fans. Heat pipes embrace the cooling plates in a circle, then bend at 90 degrees, piercing the base. At first sight it seems that the framework involves six heat pipes, but …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …
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