Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.

With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.

The initial stage of this program …

Intel may release six-core processor Core i7-3970X EE

The top board platform Intel LGA2011 is not yet very demanded among customers, mainly due to the high prices of components — motherboard with chipset X79 and processors Intel Sandy Bridge-E. However, it should be remembered that the models LGA1366 also initially were desirable for only enthusiasts with a tight purse, and only in 2010, with cheaper motherboards and the release of new, more powerful processors, Core i7, (Bloomfield / Westmere) sales statistics of LGA1366 components rose considerably.

It is possible that consumer interest in the LGA2011 platform will also grow this and especially next year. Part of this will contribute to six-core Core i7-3970X Extreme Edition which is expected to be released. Core i7-3970X EE has a clock speed of 3.4 or 3.5 GHz stock, which is in turbo mode increases up to 4.0 GHz. Other features of the model coincide with those of the 3960X:

— Process technology: 32 nm Sandy Bridge-E architecture;

— The number of cores / streams: …

HIS Offers an Overclocked R9 280 IceQ X2 OC Graphics Card

HIS is projecting to gladden all fans of highly efficient graphics cards with an indigenous design by introducing R9 280 IceQ X2 OC adapter. The new-comer differentiates itself primarily by a gold-shining coating and a factory overclocking. It is based on R9 280 Tahiti Pro GPU with dynamically heightened clock frequencies: 847 MHz/953 MHz (nominal/dynamic) against 827 MHz/933 MHz found in an etalon adapter from AMD.

HIS R9 280 IceQ X2 OC boasts 3 GB of GDDR5 video memory with 384-bit interface. It runs at the nominal 1250 MHz frequency, speeding up to an efficient index of 5.0 GHz frequency. Memory bandwidth makes up 240 Gb/sec. The integrated GPU features 1792 stream processors, 112 TMUs and 32 ROPs.

The card accommodates a couple of mini-DisplayPort video ports, as well as one HDMI and one DVI-I ports. This facilitates for the creation of multi-screen configurations. With the purpose to ensure the best image quality when working with exacting applications, the …
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Registered at: 10 June 2012, 01:12
Last visit: 10 June 2012, 01:52