XFX Teases Radeon HD 7990 Triple Dissipation Graphics Card

XFX has introduced its own version of Radeon HD 7990 — a top-tier graphics adapter from AMD. As distinct from the other companies that incorporated only some inconspicuous changes into their products, XFX has approached to the card’s modification with a violent zeal. As a result, today everyone has a chance of examining its Radeon HD 7990 Triple Dissipation card that employs two Tahiti XT GPUs, elaborated on Graphics Core next architecture.

Each Tahiti XT chip comes with 2048 stream processors and 3 GB of GDDR5 memory. This implies that the total memory capacity makes up 6 GB. GPUs run at 950 MHz clock frequency, but have the potential of achieving 1000 MHz frequency on overclocking. As for the memory, it employs 384-bit bus and runs at an efficient 6 GHz frequency.

To continue, all the components of Radeon HD 7990 Triple Dissipation are housed on an original PCB, designed by XFX. Connection with the PSU is realized via a pair of 8-contact power sockets. The rear …

Apacer Announces SAFD 25A for Cloud Computing Purposes

The sphere of cloud computing is gradually gaining in pace. In this light, this industry feels the need for the qualitative and advanced performance, as well as, enlarged capacities. Apacer is the one to understand the current tendencies by announcing the future release of SSD series specifically for cloud computing purposes. Its new SAFD 25A are promised to demonstrate both, high-end performance and capacity. The product's primary destination can be identified as an efficient tool to be employed in servers and cloud-based computing.

SAFD 25A is characterized by high performance IOPs (up to 50000 IOPs) and enlarged storage volume capacity up to 512 GB. Such specifications witness of the undeniable benefits given to customers in terms of data storage, editing and sharing. SAFD 25A can boast such outstanding features as anti-vibration and anti-shock which promote for the SSD durability. In addition, this series will be distinguished by low power consumption index that can't but …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.

With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.

The initial stage of this program …
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Registered at: 20 November 2011, 22:56
Last visit: 20 November 2011, 23:39