New Motherboard from Gigabyte with Ultra Durable 4 Classic Design

Gigabyte has recently introduced a new motherboard intended specifically for the creation of budgetary entry-level systems. Codenamed Gigabyte GA-H61M-USB3H, the model is developed in micro-ATX form-factor and features 226x174 mm dimensions. Chipset Intel H61 Express secures all key functions of the board, while the support of Socket LGA1155 empowers the incorporation of CPUs based on Intel Ivy Bridge and Intel Sandy Bridge architecture.



GA-H61M-USB3H features only two 240-contact DIMM slots for the installation of up to 16 GB of DDR3-1333 MHz memory. Video subsystem might have dual nature: it might either employ an integrated into CPU graphics core or use an independent graphics card with PCI Express 3.0 x16 internal interface. Audio subsystem is represented by Realtek ALC887 controller which secures 7.1-channel sounding. Network facilities are ensured by 1x gigabit network controller powered by Realtek.


The connection of external displays is realized via three video …

Asus Replenishes X99 Motherboard Lineup with 4 New Items

Asus adds to its renowned lineup of X99 motherboards a set of new solutions. All the greenhorns are based on Intel X99 chipset targeting socket LGA2011-v3 platforms. Thus, they support the installation of Haswell-E & Broadwell-E CPUs (Intel Core i7). The boards brag about the incorporation of multiple innovations and technologies. The latter include:

— OC Socket ensures more efficient CPU & memory overclocking;

— Asus Aura offers RGB backlight and allows for the connection of additional LED stripes;

— 5-way Optimization helps in fine tuning of system components;

— Asus SafeSlot provides for an enforced framework of PCIe slots.



Motherboard Asus X99-Deluxe II features the following specifications:

— memory subsystem: 8 DIMM slots for DDR4 memory with 3333 MHz frequency, up to 128 GB;

— storage subsystem: 2 M.2 slots, 2 U.2 slots, 1 SATA Express, 8 SATA 6 Gb/sec;

— audio subsystem: Crystal Sound 3;

— network: LAN – Intel I218-V, Intel …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …
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