Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.

With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.

The initial stage of this program …

Adata Introduces New Premier-Pro SP310 Solid-State Drives Series

Adata has recently introduced a new series of solid-state drives, entitled Premier-Pro SP310. The series consists of 32 GB, 64 GB and 128 GB models that are developed in mSATA form-factor. The drives feature 50.95x30x4 mm dimensions and are intended to be used as a speedy cache-memory or boot partition in OS for desktop and mobile devices.

Premier-Pro SP310 SSDs employ SATA 6 Gb/sec interface and are based on JMicron JFM-667 controller. The latter ensures that the drives could achieve the highest performance with the outstanding data transfer speeds. Therefore, the maximal sequential Read speed makes up 410 MB/sec, whereas the maximal sequential Write speed – 180 MB/sec. In its turn, the maximal random Read/Write speed reaches up 45.000 IOPS. Such showings are able to guarantee a substantial increase in system response speed.

To continue, the new-comers from Adata support all updated technologies, including NCQ, TRIM and S.M.A.R.T. They enhance the possibilities of the …

Evga Debuts with a First-Rate ACX CPU Cooler

Evga, a company primarily known for high-end graphics solutions, decided to expand its production line by entering cooling market. Herein, it elaborated a first-rate CPU cooler, entitled ACX (codename: 100-FS-C201-KR). The new-comer features 164x134.5x91.5 mm dimensions and weighs 1065 g. Luckily, it can be already found in free sale for a price of $50.

The ACX is a tower-like air cooler that is able to efficiently remove heat from all processors that are compatible with the following sockets: Intel LGA 2011/1156/1155/1366/1150/775 and AMD FM1/FM2/AM3/AM3+/AM2/AM2+.

Evga ACX consists of an aluminum heatsink, five copper heatpipes that support Direct Touch technology, and one PWM fan of 120 mm dimensional type. The heatsink is composed of multiple thin plates, which differentiate themselves by an unusual framework. Such framework enables the emergence of two airflows around the heatpipes. According to Evga, this promotes for a better heat removal process.

The …
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Registered at: 20 November 2011, 00:02
Last visit: 05 January 2012, 02:36