Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …

Thermaltake Unveils Extraordinary Core G3 PC Chassis

Thermaltake decided to gladden its fans with the release of an offbeat chassis – the Core G3. The new-comer is differentiated by a slim profile (454x371x140 mm); however, it might be used for the fitting of various gaming configurations. Despite Slim Tower framework, the model is able to accommodate motherboards of full ATX form-factor with two expansion slots.



Thermaltake Core G3 might be employed as vertically so horizontally. Inner space is sufficient for the integration of 310-mm long graphics cards, SFX power supply units as well as 110-mm high CPU coolers. Besides, the availability of PCI Express riser allows for the mounting of the videocard in dual positions: parallel or perpendicular to the motherboard.


In order to enhance cooling performance, the user is free to integrate a liquid cooling system with a 240-mm heatsink. Initially, the chassis is furnished with two frontal 120-mm fans; one more 120-mm fan can be installed on the top facet. All cooling slots are …

MSI Showcases R9 280X Gaming 3G LE Graphics Card with Under-Frequency

MSI Gaming lineup of graphics cards is currently rich in numerous models targeting gamers with any taste and budget. Nonetheless, the company never stops pleasing its fans, so the appearance of a new R9 280X Gaming 3G LE (Light Edition) card is quite viable. The new-comer is much alike its predecessor — R9 280X Gaming 3G, released last autumn, — but features reduced frequencies. The other specifications are almost identical.



MSI R9 280X Gaming 3G LE is based on AMD Radeon R9 280X GPU. Its modified frequency chart looks the following way: nominal clock frequency in Silent/Gaming/OC mode makes up 860 MHz, whereas dynamic clock frequency differs, depending on the mode. Hence, in Silent mode it equals to 1000 MHz, in Gaming mode – to 1010 MHz, and in OC mode – to 1020 MHz. Just to compare, the predecessor boasts some 1000 MHz nominal and 1050 MHz dynamic index.


The layout of the graphics card involves 3 GB of GDDR5 memory (384-bit bus) that runs at 6 GHz, Military …
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